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Black Shark, Realme, Vivo, Nubia, and Lenovo tease new phones with the Snapdragon 855 Plus

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Millions of people are relaxing on vacations around the world, but Qualcomm snuck in a surprise for us smartphone enthusiasts this week. The company announced a new flagship SoC, the Snapdragon 855+, which boasts both higher CPU and GPU clock speeds over the original Snapdragon 855 chipset. The community immediately began debating if certain OEMs would be using this newer chip in the smartphones they have scheduled to be released later this year. We have already heard from ASUS and now Black Shark, Realme, Vivo, Nubia, and Lenovo have all teased something on their Weibo pages.

Qualcomm making small improvements over its flagship SoC released earlier in the year isn’t new for the company. In 2016, we saw high-end smartphones launch in the beginning of the year with the Snapdragon 820 chip, but major smartphones released later in the year used the higher-clocked Snapdragon 821 instead. When we compare the Snapdragon 855 against the Snapdragon 855+, we see the following differences:

  • The lone “Prime” CPU core has been clocked at up to 2.96GHz in the 855 Plus versus 2.84GHz in the standard 855. This ~3GHz core clock speed finally matches the configuration that ARM initially projected.
  • The Adreno 640 GPU in the 855 Plus offers a 15% performance increase over the Adreno 640 in the 855.

This newer chip does not have a 5G modem built-in and is still using an external one (the Snapdragon X50 in this case). The only changes we are seeing are the increases in clock speed for the “Prime” CPU core and the increased performance from the GPU as well. We’ve seen some devices with the 855 already receive a custom kernel that supports these higher clock speeds but your mileage will vary. With the Snapdragon 855+ chips from Qualcomm, the company is making sure it is using binned chips which are proven to be stable at those higher clocks.

It does bring up questions as to how well these upcoming Snapdragon 855+ smartphones from ASUS, Black Shark, Realme, Vivo, Nubia, and Lenovo will handle the chip’s thermal limits.


Via: Gadgets 360
Source: Black Shark – Realme – Vivo – Nubia – Lenovo

The post Black Shark, Realme, Vivo, Nubia, and Lenovo tease new phones with the Snapdragon 855 Plus appeared first on xda-developers.


OPPO and Qualcomm unveil “Game Color Plus” and “Dual Wi-Fi” technologies to enhance mobile gaming

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At the ongoing China Digital Entertainment Expo and Conference in Shanghai, China, Oppo and Qualcomm took the opportunity to unveil two of their latest innovations that would enhance gaming experiences: Game Color Plus, a technology that boosts the quality of gaming images, and Dual Wi-Fi, a technology that boosts network speed.

Game Color Plus

Game Color Plus is a result of a technical collaboration by Oppo and Qualcomm. The tech is powered by Qualcomm Snapdragon Elite Gaming and Snapdragon’s self-adaptive technology, with both the companies working together on UI design, parameter adjustment, performance and power tests and bug fixes. In a nutshell, this tech aims to improve the quality of gaming visuals by boosting the details, color saturation and contrast of gaming scenes.

Oppo and Qualcomm's Game Color Plus on PUBG Mobile

Game Color Plus on PUBG Mobile: Left is Enabled, Right is Disabled

Because of the collaboration, Oppo is the first smartphone manufacturer to utilize Game Color Plus. Since the technology is not Oppo-specific, but rather Qualcomm-centric, we can expect to see it make its way to other OEMs in the future.

Dual Wi-Fi

Alongside Game Color Plus, Oppo also announced its Dual Wi-Fi technology for its phones running on ColorOS 6. This technology is supported by the DBS/DBDC (Dual Band Simultaneous/Dual-Band Dual-Concurrent) chip technology. Information sources suggest that this can be found on the Oppo Reno already, though we are unsure if this targets only the latest Qualcomm Snapdragon 855-sporting Oppo Reno 10x or even the standard Oppo Reno too. Dual Wi-Fi was also a highlight feature of MediaTek’s HyperEngine Game Technology that was announced a few days with the MediaTek G90 series.

With Dual Wi-Fi technology, compatible smartphones can connect to two different Wi-Fi hotspots simultaneously. These hotspots could be configured either with the same SSID, or different SSIDs, or be set up on one dual-band router, or on two different routers. Oppo’s Dual Wi-Fi technology enables devices to connect to two Wi-Fi connections by using policy-based routing and link aggregation and diversion technology. This ramps up the overall connection speed of the device, and also improves network experience within games as you are less likely to face network drops with two operative connections.


What are your thoughts on Game Color Plus and Dual Wi-Fi? Let us know in the comments below!

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QualPwn Overview: New vulnerability may affect more than the Snapdragon 835 and 845

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Over the years, we’ve seen a number of scary Linux-based exploits make the spotlight. We’ve seen Stagefright, RAMpage, and Cloak and Dagger, just to name a few. When both OnePlus and Xiaomi decided to release their security updates early, some predicted that there was a major exploit getting patched with this month’s security patches. Those people were right: Researchers at the Tencent Blade Team discovered a critical vulnerability that is confirmed to affect all devices with either the Qualcomm Snapdragon 835 or the Qualcomm Snapdragon 845. Dubbed, “QualPwn,” the attack allows for remote exploitation of affected devices, and the fact that it affects devices with two popular chipsets resulted in it quickly making the rounds on the Internet. However, this attack potentially affects many more chipsets, so your device could be vulnerable too.

Qualcomm issued the following statement regarding this matter:

“Providing technologies that support robust security and privacy is a priority for Qualcomm. We commend the security researchers from Tencent for using industry-standard coordinated disclosure practices through our Vulnerability Rewards Program. Qualcomm Technologies has already issued fixes to OEMs, and we encourage end users to update their devices as patches become available from OEMs.”


QualPwn – an overview

Affected devices

First and foremost, it’s worth noting that although this is considered a remote exploit, the exploit relies on the device and attacker being on the same network. You cannot attack any affected device strictly over the Internet, which means that the best way to protect yourself is to not use untrusted wireless networks. Therein lies the problem, though. Anybody on the network you’re on can theoretically attack your device without any user interaction whatsoever. All devices with the Qualcomm Snapdragon 835 or Snapdragon 845 chipsets are affected, unless they have the August 2019 security patch. Even still, according to the white paper submitted by Tencent Blade for Blackhat, the exploit still hasn’t been completely fixed.

Curiously, Qualcomm’s security bulletin detailing the issues that they fixed in the past month has a list of chipsets that’s far more comprehensive than just the Snapdragon 835 and Snapdragon 845. Just take a look below.

  • Snapdragon 636
  • Snapdragon 665
  • Snapdragon 675
  • Snapdragon 712 / Snapdragon 710 / Snapdragon 670
  • Snapdragon 730
  • Snapdragon 820
  • Snapdragon 835
  • Snapdragon 845 / SD 850
  • Snapdragon 855
  • Snapdragon 8CX
  • Snapdragon 660 Development Kit
  • Snapdragon 630
  • Snapdragon 660
  • Snapdragon 820 Automotive
  • IPQ8074
  • QCA6174A
  • QCA6574AU
  • QCA8081
  • QCA9377
  • QCA9379
  • QCS404
  • QCS405
  • QCS605
  • SXR1130

This entire list is what Qualcomm claims to have patched, meaning that pretty much any device with a chipset from the company released in the past two years is theoretically vulnerable. No public exploits have been found in the wild for any of these chipsets (including those tested by the Tencent Blade team), but it’s scary that such a huge amount of devices could potentially be vulnerable.

I did some digging and discovered that in the past, Qualcomm has been known to create security patches for major issues and even distribute them to some devices that aren’t affected by a particular bug, just in the interest of safety. It’s possible that has occurred for some of the chipsets listed here, but it’s also possible that the majority are theoretically vulnerable. So what can you do?

Mitigation

Thankfully, this bug hasn’t really been exploited in the wild, and it would require a huge number of theoretical conditions to come true before any of your data is at risk. You would need to connect to the same WiFi network as somebody who has knowledge of the exploit and knows how to abuse it (despite there being no public way of doing so at the time of writing). What’s more, the exploit is already fixed if your device has the August 2019 security patch, so interest will quickly die down amongst would-be exploiters. This bug may be why OnePlus rushed to publish the August security patches early, as the patches themselves weren’t under embargo, only the details of the exploits themselves were.

Nevertheless, this is still a critical security flaw and one that shouldn’t just be ignored. The fixes are in the hands of OEMs now, and there’s not a whole lot more that Qualcomm can actually do. If you can’t get over the list of potentially affected chipsets and you have no way of getting the latest security patches, then the only thing you can do is buy a new smartphone.

What is QualPwn?

To spare you the gory details, QualPwn exploits WLAN interfaces on a given Qualcomm chipset to give an attacker control over the modem. From there, the kernel can be attacked and potentially get exploited by an attacker as well, who can then potentially gain full root access to someone else’s device. Anything could then be installed by a would-be attacker, compromising your data as a result. It could theoretically be used to gain root access on your own device, although there will need to be a lot of work put in to make that actually happen.

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GlobalFoundries sues TSMC and 20 companies to block chip shipments to the US and Germany

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SoC’s, or System-on-a-Chip, form the brains of a smartphone, directly dictating the capabilities, power, and features of the smartphone. SoCs are at the forefront of the smartphone upgrade cycle, as OEM refresh cycles are dependent on new features being brought over by the advancement to the SoC. While companies like Qualcomm design their own SoCs and spend millions on R&D, the actual manufacturing is orchestrated by a semiconductor foundry like Taiwan Semiconductor Manufacturing Company (TSMC).  Another semiconductor foundry, GlobalFoundries has now filed lawsuits against TSMC and named 20 other defendants in the USA and Germany, alleging TSMC of patent infringement.

The primary subject matter in the multiple lawsuits filed by GlobalFoundries alleges that TSMC has infringed upon as many as 16 of its patents across different aspects of chip manufacturing, including the ones involving 7nm, 10nm, 12nm, 16nm, and 28nm manufacturing nodes. Since TSMC is based in Taiwan and hence outside of the jurisdiction of USA and Germany, the lawsuits have named 20 customers of TSMC as defendants towards the same:

  • Foundry: Taiwan Semiconductor Manufacturing Company Ltd. (TSMC)
  • Fabless chip designers: Apple, Broadcom, Mediatek, Nvidia, Qualcomm, Xilinx
  • Electronic component distributors: Avnet/EBV, Digi-key, Mouser
  • Consumer product: Arista, ASUS, BLU, Cisco, Google, HiSense, Lenovo, Motorola, TCL, OnePlus

These customers import chips made by TSMC into the jurisdiction areas for further use and subsequent sale within finished products. The damages claimed in the lawsuit could reach billions of dollars as the alleged infringement took place on processes that contributed to more than half of TSMC’s revenue. The pleas from GlobalFoundries also include a request to the Courts to ban the shipments of products that use these semiconductors that allegedly infringe the patents, into the USA and Germany separately. If the Courts do decide to grant the injunction on a prima-facie case, this could halt the import of a whole range of electronics ranging from smartphones from Apple, Google, OnePlus and various other smartphones that use Qualcomm SoCs made by TSMC, and even routers and graphics cards.

GlobalFoundries issued the following statement in connection with these lawsuits:

While semiconductor manufacturing has continued to shift to Asia, GF has bucked the trend by investing heavily in the American and European semiconductor industries, spending more than $15 billion dollars in the last decade in the U.S. and more than $6 billion in Europe’s largest semiconductor manufacturing fabrication facility. These lawsuits are aimed at protecting those investments and the US and European-based innovation that powers them,” said Gregg Bartlett, senior vice president, engineering and technology at GF. “For years, while we have been devoting billions of dollars to domestic research and development, TSMC has been unlawfully reaping the benefits of our investments. This action is critical to halt Taiwan Semiconductor’s unlawful use of our vital assets and to safeguard the American and European manufacturing base.

In response, TSMC has issued the following statement:

TSMC is in the process of reviewing the complaints filed by GlobalFoundries on August 26, but is confident that GlobalFoundries’ allegations are baseless. As a leading innovator, TSMC invests billions of dollars each year to independently develop its world-class, leading-edge semiconductor manufacturing technologies. As a result, TSMC has established one of the largest semiconductor portfolios with more than 37,000 patents worldwide and a top 10 ranking for US patent grants for 3 consecutive years since 2016. We are disappointed to see a foundry peer resort to meritless lawsuits instead of competing in the marketplace with technology. TSMC is proud of its technology leadership, manufacturing excellence, and unwavering commitment to customers. We will fight vigorously, using any and all options, to protect our proprietary technologies.

While we do not comment on the merits of the lawsuit as we do not properly understand the entire scope of these patents and the alleged infringement, one thing is clear — if GlobalFoundries does win this lawsuit, one can expect the technology landscape to shift in a major way.


Source: GlobalFoundries, TSMC;
Story Via: Anandtech;
Feature Image Credits: Taiwan Semiconductor Manufacturing Co., Ltd

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Qualcomm announces 5G connectivity for upcoming 7-Series and 6-Series Snapdragon chipsets

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There is no shortage of interesting announcements coming out of IFA 2019, with many key names in the mobile space cluing us in on their upcoming product line-ups. Qualcomm is making some important connectivity announcements of its own, shortly after its Samsung’s latest 5G-capable chipset reveal. The company has revealed that it will bring 5G to multiple tiers of Snapdragon chipsets, expanding 5G connectivity beyond their flagship 8-Series platform. On top of that, Qualcomm has now given a name to their “system-level” approach to 5G connectivity, while also announcing the first fully integrated, extended-range mmWave solution for 5G fixed wireless access.

As stated, Qualcomm is looking to expand its portfolio of 5G mobile platforms by integrating 5G connectivity into the 7-Series and 6-Series for 2020 devices, with the rollout aiming to support features and frequency bands globally. The company claims the upcoming mid-range chipsets will deliver best-in-class cellular performance, coverage, and power-efficiency at a global scale, supporting all key regions and frequency bands including mmWave and sub-6 GHz spectrum, TDD and FDD modes, 5G multi-SIM, Dynamic Spectrum Sharing, and Standalone (SA) and non-standalone (NSA) network architectures.

We also learned that the upcoming Snapdragon 7-Series chipset will be built on 7nm process technology, have 5G integrated into a SoC, and it will reportedly bring other premium-tier features including the next gen Qualcomm AI engine and select Snapdragon Elite Gaming features. This is something which we’ve come to expect as flagship functionality increasingly makes its way to the company’s mid-range platforms. Qualcomm states that sampling to customers began in the second quarter of 2019, with commercial readiness of the platform expected for the fourth quarter of the year, and devices likely launching soon thereafter. Twelve leading OEMs and brands have been confirmed to be employing the upcoming 7-Series 5G platform, including OPPO, realme, Redmi, Vivo, Motorola, HMD Global and LG Electronics.

Snapdragon X55 5G Modem-RF System

he Snapdragon X55 5G Modem-RF System is Qualcomm’s current flagship solution.

Speaking of the aforementioned “system-level” approach to 5G, the company is now symbolically unifying their differentiated modem, RF transceiver and RF Front-end solutions under a single name: Snapdragon 5G Modem-RF systems. This is largely a new branding strategy, intended to better communicate the holistic, approach to connectivity that the company has invested in, and that is currently powering over 150 5G-ready designs that have either been launched or are currently in development (this figure includes not just smartphones, but also hotspots and other devices implementing 5G technology).

Finally, Qualcomm introduced the QTM527 mmWave antenna module for the Snapdragon X55 5G Modem-RF System. This is the world’s first fully integrated extended-range mmWave solution for 5G fixed wireless access, enabling mobile operators to leverage their 5G network infrastructure in order to deliver fixed internet broadband services to homes and businesses. It further allows OEMs to develop more portable customer-premise equipment at scale, meaning competitive plug-and-play, multi-gigabit alternatives to cable and fiber that can be deployed on a roof or a window, thus bypassing the fiber deployment typically needed for in-home broadband.

Beyond these announcements, Qualcomm’s press release hinted that more details on the next generation Snapdragon 8-Series 5G Mobile platform will be coming later this year. As always, stay tuned for the latest Qualcomm Snapdragon coverage.

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Qualcomm announces support for India’s NavIC Satellite Navigation System

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In a bid to improve location services in the region, Qualcomm has officially announced support for India’s Regional Navigation Satellite System (IRNSS) in select chipsets across the company’s upcoming portfolio. This initiative, which was undertaken in collaboration with the Indian Space Research Organization (ISRO), will make use of India’s NavIC constellation of 7 satellites to enhance the geolocation capabilities of mobile, automotive, and Internet of Things (IoT) solutions in the region. The collaboration successfully conducted its first-ever NavIC demonstration using the Qualcomm Snapdragon Mobile Platform on September 19 and is scheduled to showcase the solution again at the ongoing India Mobile World Congress.

The Navigation with Indian Constellation (NavIC) system covers India and a region extending 1,500 km from its borders. It provides accurate real-time positioning and timing services on two levels – the “standard positioning system” which will be open for civilian use and the “restricted service” which is encrypted and reserved for authorized users only. The constellation boasts of an accuracy of 10 meters for the standard system and brings it down to just 0.1 meters in the reserved service. Now that the system is officially supported by Qualcomm, it’s expected to improve the user experience for location-based applications in India in the following months.

The new solution is built on Qualcomm’s leading foundational inventions in location-based position technology. As part of the updated platforms, the Qualcomm Location Suite will now support up to seven satellite constellations at the same time, including all of NavIC’s operational satellites for improved accuracy, faster time-to-first-fix (TTFF), and improved stability of location-based services in the region.

In a statement regarding the announcement, ISRO Chairman Mr. K. Sivan was quoted saying, “NavIC is a critical step forward in our pursuit of harnessing space technology for national development and we are eager to make it accessible to everyone for their day to day use. ISRO is very happy to work with Qualcomm to enable NavIC on Mobile platforms. Qualcomm’s technology leadership and support for NavIC on their mobile platforms will bring the benefits of this indigenous solution to every Indian.”

According to Qualcomm, support for NavIC will be made available in select Qualcomm Technologies’ chipset platforms starting November 2019, with commercial devices expected to hit the market in the first half of 2020. Upcoming Snapdragon 7-series and 6-series chipsets are also expected to come with 5G support.


Source: Qualcomm, ISRO

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Qualcomm’s upcoming Snapdragon Wear 3300 may be the Wear OS smartwatch chip we’ve been waiting for

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Google’s Android OS for smartwatches, Wear OS, isn’t nearly as successful as Android for smartphones, tablets, or televisions, and there’s a lot of blame to go around for that. We can blame Google for not having enough confidence to launch its own smartwatch hardware or for barely giving Wear OS the time of day at its big developer conference, or we can blame Qualcomm for failing to design a competitive smartwatch SoC. Smartwatches from Samsung, Huawei, and Apple, with their custom operating systems and SoCs, tend to have much better battery life than smartwatches with Wear OS and Qualcomm’s Snapdragon Wear 2100 or 3100. Qualcomm’s current wearable platforms are manufactured on a 28nm fabrication process; in comparison, Samsung’s Exynos 9110, found in the Galaxy Watch series, is manufactured on a 10nm fabrication process. Qualcomm may be bridging the gap with its next SoC for wearables, however, and it could come in the form of the Snapdragon Wear 3300.

We first heard about Qualcomm’s next wearable chipset back in July when WinFuture reported on the existence of two chipsets in a prototyping stage. It was believed that one of the chipsets could be marketed as the Snapdragon Wear 2700 and the other the Snapdragon 429 Wear, but the chipsets were still very early in development and there was no indication of when they would launch. Thanks to a tip from XDA Recognized Developer arter97, we know that Qualcomm is indeed preparing a chipset based on the mid-2018 Snapdragon 429 mobile platform, and it’ll likely be called the Snapdragon Wear 3300.

Over on the Code Aurora Forum, where Qualcomm uploads the Linux kernel source code for its various chipsets, a commit was uploaded that adds a device tree for a “SDW3300 device.” The device tree source (DTS) file that was uploaded is titled “sdw3300-bg-1gb-wtp.dts,” and the code indicates the new platform is based on the Snapdragon 429, code-named “Spyro.”

The Qualcomm Snapdragon 429 was introduced in mid-2018 as a 12nm chip with 4 ARM Cortex-A53 CPU cores clocked at up to 1.95GHz. Qualcomm will likely pair these 4 CPU cores with a low-power co-processor, a PMIC, an integrated DSP, and other components to form the new Snapdragon Wear platform. The biggest problem with the Snapdragon Wear 3100 was that its main application processor was still the 4 ARM Cortex-A7 CPU cores fabricated on a 28nm process, so the new wearable SoC should be much more power-efficient and thus provide better battery life. Paired with 1GB of RAM, future Wear OS smartwatches will also perform better than ever.

Of course, this is still just a rumor at this point. Qualcomm has yet to officially confirm any details about its next wearable SoC. We reached out to Qualcomm for comment and will update this article if we hear back.

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2019 Snapdragon Tech Summit starts December 3rd, Snapdragon 865 announcement expected

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Qualcomm’s Snapdragon Tech Summit is an annual event during which the chipmaker unveils its upcoming offerings. At last year’s event, Qualcomm unveiled its flagship Snapdragon 855 mobile platform for 2019. It also unveiled the Snapdragon X50 modem, along with the QTM052 mmWave antenna module, that can be found on most 5G enabled smartphones today. Along with that, the company launched the Qualcomm Spectra 380 — the world’s first image signal processor (ISP) with integrated artificial intelligence.

Furthermore, Qualcomm also showcased the Snapdragon 8cx compute platform, to power a new generation of premium Always on, Always Connected PCs. The new chip featured 4×4 Kryo 495 CPU cores with a larger system and L3 cache that allowed for faster multitasking. On the graphics front, the chip included the new Adreno 680 GPU, promising double the performance and 60% greater power efficiency compared to the Snapdragon 850. It is the most powerful platform to come out of Qualcomm’s stables.

Now, the company has officially announced the dates for the Snapdragon Tech Summit 2019 and we expect to see some impressive new hardware at the event. The event is scheduled to start on December 3rd in Maui, Hawaii. At the event, the company is expected to announce the new Snapdragon 8xx series chip (most likely the Snapdragon 865) for the mobile platform. As with last year’s event, we also believe that Qualcomm will showcase ISP advancements, along with an upgraded 5G modem. While Snapdragon 8cx powered laptops are just starting to hit the market, the company may also announce some improvements to the platform at this year’s event.

Much like last year, we here at XDA will be attending the event to cover all the latest news we thing you should know about. Make sure you stay tuned to our coverage to catch all the latest announcements at the Qualcomm Snapdragon Tech Summit 2019.


Source: Qualcomm

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Snapdragon Tech Summit 2019 Summary – The Latest SoC and 5G News From Qualcomm

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Qualcomm is hosting its annual Snapdragon Tech Summit this week in Hawaii. Last year, 5G was a big focus of the event, and that will continue this year as well. We’re also expecting to see the announcement of the Snapdragon 865. We will be in attendance and reporting on all the big happenings right here on XDA, but you can also follow the event as it happens on your own. There are a number of ways to do that.

The first livestream will begin on December 3rd at 2 PM ET. You can watch the latest livestream below.

If you prefer to follow the news as it happens on Twitter, you can follow the #SnapdragonSummit hashtag here. You can also visit Qualcomm’s Snapdragon Tech Summit page here.


Below, we’ll directly link our coverage for each day of the Summit. Check back here for the latest news, or you can also follow us on TwitterFacebookDiscord, Telegram, RSS, or the XDA Labs app.

Day 1 – December 3rd

Day 2 – December 4th

Day 3 – December 5th

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Qualcomm teases the Snapdragon 865 and Snapdragon 765 and announces the larger 3D Sonic Max fingerprint sensor

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During the first day of their annual Snapdragon Tech Summit, Qualcomm unveiled the names and logos of its 3 new SoCs. The Snapdragon 765 and 765G join the Snapdragon 730 and 710 in the upper mid-range tier of Qualcomm’s chipsets, while the new Snapdragon 865 succeeds the Snapdragon 855 as Qualcomm’s premium mobile SoC. In addition, the company announced a new version of its ultrasonic under-display fingerprint sensor technology: 3D Sonic Max.

Snapdragon 865 and Snapdragon 765 Teased

Qualcomm Snapdragon 765 logo Qualcomm Snapdragon 765G logo Qualcomm Snapdragon 865 logo

Logos for Qualcomm’s 3 new mobile platforms.

At the keynote event for day 1 of the Tech Summit, Alex Katouzian, SVP and GM of mobile at Qualcomm, announced that the Snapdragon 865 can be paired with Qualcomm’s Snapdragon X55 modem for 4G and 5G connectivity. The advantages of the newer X55 modem over the older X50 modem include being manufactured using a newer, more power efficient process, higher theoretical download and upload speeds, support for standalone (SA) networks in addition to non-standalone (NSA), support for mmWave and sub-6GHz in FDD frequencies, and more bandwidth at sub-6 GHz frequencies. We can expect to see most 2020 Android flagship smartphones utilizing the Snapdragon X55 multi-mode modem along with the new Snapdragon 865. Xiaomi confirmed the upcoming Mi 10 will utilize the Snapdragon 865, while OPPO also confirmed that an upcoming smartphone will launch in Q1 2020 with the new chipset. Motorola is also returning to the flagship scene next year with an unnamed smartphone powered by the 865.

Although Qualcomm announced that the Snapdragon 765 and 765G bring “integrated” 5G connectivity (meaning the modem is integrated into the SoC), they did not disclose more details on the modem. Qualcomm had previously announced than an upcoming Snapdragon 700 series (and 600 series) mobile platform will bring integrated 5G connectivity with features such as support for all key regions and frequency bands, TDD and FDD modes, multi-SIM 5G, Dynamic Spectrum Sharing (DSS), and SA and NSA network architectures. Presuming this earlier announcement pertains to the Snapdragon 765 SoC that was teased today, then, we can expect it to be manufactured using a 7nm process technology. Multiple OEMs have confirmed their intentions to utilize the new 7-series 5G platform on their devices, including HMD Global, OPPO, Realme, Redmi, Vivo, Motorola, and LG. We can expect to see product teasers this week followed by product launches later this year and early next year. Already, the Redmi K30 from Xiaomi and the Reno3 Pro 5G from OPPO have been confirmed to use the Snapdragon 765/765G respectively.

Lastly, Qualcomm also announced Snapdragon Modular Platforms based on the Snapdragon 865 and Snapdragon 765. According to Qualcomm, these “mobile platform-based modules” are designed to help carriers lower the development costs of commercializing new 5G mobile and IoT devices. So far, Verizon and Vodafone have announced support for the certification program.

More details of the Snapdragon 865 and Snapdragon 765 will be shared during day 2 of the Tech Summit.

3D Sonic Max

Last year, Qualcomm announced the 3D Sonic Sensor – the company’s ultrasonic under-display fingerprint technology. It’s used in the Samsung Galaxy S10 and Samsung Galaxy Note 10. Now, Qualcomm has announced an upgraded version of this technology. Called 3D Sonic Max, the newer technology “offers a recognition area that is 17x larger” than the 3D Sonic Sensor. Specifically, the new sensor is 30mm by 20mm in size, allowing for 1::1,000,000 versus previously 1::50,000 accuracy. This allows for better security as two fingers can be authenticated simultaneously, and you’ll also have an easier time finding where to put your finger, increasing unlocking speed.

Qualcomm 3D Sonic Max

3D Sonic Max allowing for dual fingerprint authentication. Source: Qualcomm

3D Sonic Max is a separate module that OEMs must license from Qualcomm to implement. The 3D Sonic Sensor did not require a specific Qualcomm SoC, though we don’t know if that’s also the case for the new 3D Sonic Max. After issues with the 3D Sonic Sensor’s security were discovered, Korean analysts told The Korea Times that Samsung may ditch Qualcomm’s ultrasonic fingerprint sensors in next year’s Galaxy S11. It’s possible the new 3D Sonic Max will prevent a repeat of these issues, but we’ll have to wait until February to find out what Samsung is planning.


You can follow all the news from the Tech Summit by bookmarking our article round-up of the event or visiting Qualcomm’s Tech Summit page.

Disclaimer: Qualcomm sponsored my trip to Maui, Hawaii, to attend the Snapdragon Tech Summit. The company paid for my flight and hotel. However, they did not have any input regarding the content of this article.

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Xiaomi Redmi K30 and OPPO Reno 3 Pro will have the 5G Snapdragon 765G

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Qualcomm is busy teasing the Snapdragon 865 and Snapdragon 765 today at the Snapdragon Tech Summit. While the company hasn’t disclosed many details of these chips yet, we’re already hearing about the devices that will run them. The Xiaomi Mi 10 has been confirmed to feature the Snapdragon 865, and now we know the Redmi K30 will have the 5G Snapdragon 765G, thanks to Bin Lin, Xiaomi’s Co-Founder and Vice Chairman. The 765G is the gaming-centric variant of the Snapdragon 765. Alen Wu, vice president and president of global sales at OPPO, revealed that the company’s upcoming Reno3 Pro 5G will also be powered by the Snapdragon 765G.

The Redmi K30 has shown up a few times in recent months. Back in August, Xiaomi confirmed it would have 5G support, and that is indeed the case with the Snapdragon 765G. Some of the other important highlights include a 120Hz display, 60 or 64MP Sony IMX686 primary lens, quad rear cameras, dual front hole-punch cameras, and side-mounted fingerprint scanner. The phone is expected to be officially announced on December 10th.

As for the OPPO Reno3 Pro, we don’t know nearly as much about it. It was confirmed to support 5G connectivity, so the Snapdragon 765G makes sense in that regard. Some of the other specifications include a 4,025 mAh battery and a thin 7.7mm body. OPPO’s VP shared a teaser image of the device late last month.

We still have a lot to learn about the Snapdragon 765G and what it will be capable of. Qualcomm will reveal more details about the 765 and 765G during day 2 of the Snapdragon Tech Summit. Expect both the Redmi K30 and Reno3 Pro to be among the first to ship with Qualcomm’s latest upper mid-range chip.


Update: This article was updated at 9:09 PM ET to reflect that the Redmi K30 will be powered by the gaming variant of the Snapdragon 765, the Snapdragon 765G.

The post Xiaomi Redmi K30 and OPPO Reno 3 Pro will have the 5G Snapdragon 765G appeared first on xda-developers.

Qualcomm announces the Snapdragon 865 with support for 5G, 200MP cameras, and 144Hz displays

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Qualcomm’s Snapdragon chipsets are found in millions of Android smartphones and tablets thanks to the fact that Qualcomm designs chips for budget, mid-range, and premium mobile devices. Every December, Qualcomm hosts an event they call the Snapdragon Tech Summit where they announce their latest high-end mobile platforms. This year, the company has two new SoCs to show off: the Qualcomm Snapdragon 765 and the Qualcomm Snapdragon 865. The latter is the successor to the Qualcomm Snapdragon 855 that’s found in most flagship Android devices released in 2019, and it features major upgrades in key areas like the CPU, DSP, ISP, and modem.

With every new addition to the Snapdragon 800 series, we see year-on-year improvements that are within our expectations. What makes this year different is that the rest of the industry is finally catching up and making use of the chips’ full capabilities. 5G connectivity is no longer just a talking point – it’s already available in many cities and supported by a handful of devices. High megapixel, multi-camera devices are becoming the norm – the 108MP penta-camera Xiaomi Mi Note 10 immediately comes to mind. High refresh rate technology is now mainstream in the mobile industry as many of the big players add 90 or even 120Hz panels on their latest devices. With the new Qualcomm Snapdragon 865, we could see devices in 2020 have even higher megapixel cameras, faster refresh rate panels, and faster network connectivity than we’ve ever seen before.

There are many big generational changes that Qualcomm is highlighting this year, but there are also a lot of smaller improvements we’ve spotted while digging through the Snapdragon 865 specification sheet. Here’s everything you need to know.

Disclaimer: Qualcomm sponsored my trip to Maui, Hawaii, to attend the Snapdragon Tech Summit. The company paid for my flight and hotel. However, they did not have any input regarding the content of this article.

To start off, here’s a table I put together that extensively compares the previous generation Qualcomm Snapdragon 855 with the new Qualcomm Snapdragon 865. The table is dense and might be hard to follow if you’re not already familiar with most of these terms. Below the table, I’ve divided my explanations of the year-on-year improvements and new features into multiple sections.

Qualcomm Snapdragon 855 (sm8150) Qualcomm Snapdragon 865 (sm8250)
CPU 1x Kryo 485 (ARM Cortex A76-based) Prime core @ 2.84GHz, 1x 512KB pL2 cache

3x Kryo 485 (ARM Cortex A76-based) Performance cores @ 2.42GHz, 3x 256KB pL2 cache

4x Kryo 385 (ARM Cortex A55-based) Efficiency cores @ 1.8GHz, 4x 128KB pL2 cache

2MB sL3 cache

1x Kryo 585 (ARM Cortex A77-based) Prime core @ 2.84GHz, 1x 512KB pL2 cache

3x Kryo 585 (ARM Cortex A77-based) Performance cores @ 2.4GHz, 3x 256KB pL2 cache

4x Kryo 385 (ARM Cortex A55-based) Efficiency cores @ 1.8GHz, 4x 128KB pL2 cache

4MB sL3 cache
25% faster performance

GPU Adreno 640 @ 600MHz
Vulkan 1.1
Snapdragon Elite GamingVideo playback: H.264 (AVC), H.265 (HEVC), VP8, VP9, 4K HDR10, HLG, HDR10+, Dolby Vision
Adreno 650
Vulkan 1.1
Snapdragon Elite Gaming with new Desktop Forward Rendering, Game Color Plus, updatable GPU drivers
20% faster graphics rendering
35% more power efficient
Video playback: H.264 (AVC), H.265 (HEVC), VP8, VP9, 4K HDR10, HLG, HDR10+, Dolby Vision
Display Maximum On-Device Display Support: UHD
Maximum External Display Support: UHD
HDR support
DisplayPort over USB Type-C support
Maximum On-Device Display Support: UHD @ 60Hz, QHD+ @ 144Hz
Maximum External Display Support: UHD @ 60Hz
HDR support
DisplayPort over USB Type-C support
AI Hexagon 690 with Hexagon Vector eXtensions and Hexagon Tensor Accelerator
4th generation AI Engine
7 TOPS
Hexagon 698 with Hexagon Vector eXtensions and new Hexagon Tensor Accelerator
5th generation AI Engine
Qualcomm Sensing Hub
15 TOPS
Memory 4 x 16-bit LPDDR4 @ 2133MHz, 16GB
3MB system level cache
4 x 16-bit LPDDR4 @ 2133MHz, 16GB
LPDDR5 @ 2750MHz
3MB system level cache
ISP Dual 14-bit Spectra 380 ISP

Single camera: Up to 48MP with ZSL; Up to 192MP

Dual camera: Up to 22MP with ZSL

Video capture: 4K HDR @ 60 fps; Slow motion up to 720p@480 fps; HDR10, HDR10+, HLG

Dual 14-bit Spectra 480 ISP

Single camera: Up to 64MP with ZSL; Up to 200MP

Dual camera: Up to 25MP with ZSL

Video capture: 4K HDR @ 60 fps + 64MP burst images; 4K @ 120 fps; 8K @ 30 fps; Slow motion up to 720p@960 fps (unlimited); HDR10, HDR10+, HLG, Dolby Vision

Modem Snapdragon X24 4G LTE modem
Downlink: 2.0Gbps
Uplink: 316MbpsSnapdragon X50 5G modem
Downlink: 5.0Gbps
Modes: NSA, TDD
mmWave: 800MHz bandwidth, 8 carriers, 2×2 MIMO
sub-6 GHz: 100MHz bandwidth, 4×4 MIMO
Snapdragon X55 4G LTE and 5G multimode modem
Downlink: 7.5Gbps (5G), 2.5Gbps (4G LTE)
Uplink: 3Gbps, 316Mbps (4G LTE)
Modes: NSA, SA, TDD, FDD
mmWave: 800MHz bandwidth, 8 carriers, 2×2 MIMO
sub-6 GHz: 200MHz bandwidth, 4×4 MIMO
Charging Qualcomm Quick Charge 4+ Qualcomm Quick Charge 4+
Qualcomm Quick Charge AI
Connectivity Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS, Dual Frequency support

Wi-Fi: Qualcomm FastConnect 6200; Wi-Fi 6 ready; 2.4/5GHz Bands; 20/40/80 MHz Channels; DBS, TWT, WPA3, 8×8 MU-MIMO

Bluetooth: Version 5.0, aptX TWS and aptX Adaptive

Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS, Dual Frequency support

Wi-Fi: Qualcomm FastConnect 6800; Wi-Fi 6 certified; 2.4/5GHz Bands; 20/40/80 MHz Channels; DBS, TWT, WPA3, 8×8 MU-MIMO, OFDMA, 1024QAM

Bluetooth: Version 5.1, aptX TWS, aptX Adaptive, and aptX Voice

Manufacturing Process 7nm (TSMC’s N7) 7nm (TSMC’s N7P)

CPU

Qualcomm says the Snapdragon 865 offers 25% faster raw CPU performance over the Snapdragon 855 or 25% better CPU power efficiency at the same performance point. How did they achieve this performance and efficiency uplift? Most likely due to the addition of newer ARM cores. The Qualcomm Snapdragon 865 features the same CPU core configuration (and even the same clock speeds and pL2 cache!) as the Snapdragon 855, but the lone Prime core and 3 Performance cores are now derived from the ARM Cortex-A77 design rather than the Cortex-A76. Qualcomm calls these new CPU cores the Kryo 585, and reportedly, this time they offer no customization over the standard ARM Cortex A77 reference design. Last year’s Kryo 485 improved upon the ARM Cortex A76 design by introducing bigger out-of-order execution windows and reorder buffer, and more efficient data pre-fetchers.

ARM Cortex-A77ARM Cortex-A75 vs. Cortex-A76 vs Cortex-A77 single CPU core @ 3GHz benchmarked in SPEC int2006. Source: ARM.

GPU

For the new Adreno 650, Qualcomm touts impressive 20% faster graphics rendering or 35% greater power efficiency (at the same performance point) figures when compared to the Adreno 640 in last year’s Snapdragon 855. Qualcomm emphasizes that the new Adreno 650 allows for better sustained performance, meaning it’ll take longer before your games start dropping frames. Unfortunately, we don’t have many details on the intricacies of the Adreno 650 itself (such as its maximum clock speed), as Qualcomm is very protective of its custom GPU design. For good reason, too: the Adreno GPU has long outperformed ARM’s Mali GPU. Of course, we’ll have to benchmark the GPU performance on a Snapdragon 865 device to confirm if that’s still true with this generation.

As mobile games continue to grow in popularity and subsequently become more complex and performance intensive, Qualcomm is responding with a series of features under its “Snapdragon Elite Gaming” brand. Snapdragon Elite Gaming was introduced with the Snapdragon 855 last year, and it’s currently composed of features like Jank Reducer that aim to optimize the chipset’s operation during gaming. Now, Snapdragon Elite Gaming is adding support for 5 new features: Desktop Forward Rendering, Game Color Plus, updatable GPU drivers, Snapdragon Game Performance Engine, and Adreno HDR Fast Blend.

  • Desktop Forward Rendering: Qualcomm worked to bring this feature of the Unreal Engine to Android. It’s used by game developers for desktop-class dynamic shadows, planar reflections, motion blur, and other post-processing effects.
  • Game Color Plus: More and more smartphones have HDR-compliant displays. However, HDR content is still scarce, especially in mobile gaming. This feature converts the colors of mobile games from SDR to HDR but supposedly does so in an “intelligent” way as to not sacrifice color accuracy. Qualcomm promises “enhanced details, boosted color saturation and local tone mapping.” OPPO previously announced that they will be first to utilize this technology.

    Game Color Plus on PUBG Mobile: Left is Enabled, Right is Disabled

  • Updatable GPU drivers: Typically, updates to the GPU driver are packaged along with other updates before being sent OTA to users. New to the Snapdragon 865 BSP is the ability to update a separate GPU driver stub. If supported by the OEM, the user can download updates to the GPU driver directly from an app store. Google made this possible on the Android side with Project Treble, but we’ve yet to see many OEMs take advantage of this.
  • Snapdragon Game Performance Engine: Qualcomm didn’t provide many details on this feature, but the Snapdragon 865 press release states that “game play is now optimized to the micro-second level” with this feature, “providing adaptive and predictive real-time system tuning for sustained performance over longer periods of time.” It sounds like there could be some machine learning in use here – perhaps OEMs or developers can train models based on game play that, when deployed, adjust parameters to maintain peak performance, similar to how Huawei’s GPU Turbo works.
  • Adreno HDR Fast Blend: This is a new “hardware embedded” feature that can be used to improve performance by up to 2x (when compared to the Snapdragon 855) in scenes with heavy blending, such as when complex particles are rendered on screen.

Display

High refresh rate displays have been a staple of PC gaming for years – just look at how many 144Hz gaming monitors are out there – but the technology has finally taken off in the mobile space. The Google Pixel 4, OnePlus 7T, Realme X2 Pro, and OPPO Reno Ace were all recently released with 90Hz displays, while the ASUS ROG Phone II and Sharp Aquos R3 have 120Hz displays. While the ROG Phone II and Aquos R3 have smoother displays, they sacrifice on display resolution to achieve it. Displays with a high resolution and high refresh rate put a heavy strain on the GPU, but the Adreno 650 in the Snapdragon 865 is capable of pushing QHD+ resolution at 144Hz. We don’t know when a smartphone with a QHD+ 144Hz display will be available, but if one is already in the works, it’ll most likely be powered by the Snapdragon 865.

Qualcomm’s 3D Sonic technology, the company’s ultrasonic under-display fingerprint scanner, is still supported, but notably, the technology is getting a major upgrade. The newer version of the technology is called 3D Sonic Max and has a recognition area of 30mm by 20mm, 17x larger than before. Qualcomm says the accuracy is now 1::1,000,000 versus 1::50,000. The larger recognition area makes it possible for two fingers to be authenticated simultaneously, though in more practical terms, it’ll result in the user having an easier time finding where to place their finger on the sensor.

Qualcomm 3D Sonic Max

3D Sonic Max allowing for dual fingerprint authentication. Source: Qualcomm

Only Samsung used the 3D Sonic fingerprint scanner on the Galaxy S10 and Galaxy Note 10, so it’s possible the upcoming Galaxy S11 could feature the new 3D Sonic Max technology.

AI

Although a lot of what’s out there is snake oil, there are lots of legitimately impressive and useful features that take advantage of what we call “AI.” Take, for example, the Google Pixel 4’s automatic white balance adjustment and Astrophotography features. Google trained one model against a set of photos with and without good lighting, and they trained another model based on a set of photos of the starry sky. The result is that the Pixel 4 can infer what the best white balance setting should be to correct poor lighting (automatic white balance adjustment), and it can also segment the skyline from trees and other ground objects (Astrophotography). Both features require the kind of computational power provided by the Snapdragon’s Spectra ISP, Hexagon DSP, and Adreno GPU.

The combination of improvements to the GPU, DSP, and other blocks has provided an over 2x year-on-year boost in AI performance. While the Snapdragon 855 managed 7 TOPS (trillions of operations), the Snapdragon 865 manages 15 TOPS. This is thanks to the 5th generation AI engine in the Snapdragon 865. The biggest improvement in the 5th generation AI engine is the newer Hexagon Tensor Accelerator in the Hexagon 698 DSP. Qualcomm upgraded the HTA to provide over 4x TOPS performance while being 35% more power efficient.

Qualcomm designed a new component it’s calling the “Sensing Hub” that’s designed to efficiently detect audio. The Sensing Hub utilizes <1mW of power, allowing it to remain always-on at virtually no power cost. It supports multi-word wakeup, meaning it can react to “Hey Google” or “Alexa” hotwords to trigger Google Assistant or Amazon Alexa queries. The sensor framework is scalable, so it isn’t limited to just these use cases. For example, Qualcomm says the Sensing Hub could be used to listen for sounds indicative of driving, office work, movie theaters, etc. Developers can use the updated Qualcomm Neural Processing SDK, Hexagon NN Offload Framework, and Qualcomm AI Model Enhancer tools to create these and other features.

ISP

Arguably the biggest improvement in the Snapdragon 865 over the Snapdragon 855 is in the ISP. The new Spectra 480 ISP can process 2 Gigapixels per second. To take advantage of this increased processing performance, Qualcomm slowed down the clock cycles and started processing 4 pixels per clock cycle rather than 1 pixel per clock cycle. The result is improved power saving, better thermal efficiency, and 40% faster pixel processing for tasks like noise reduction. In addition, the Spectra 480 has a new Video Analytics Engine (EVA) to handle all Computer Vision (CV) tasks.

The “Gigapixel speed” of the Spectra 480 ISP makes it possible to capture 4K HDR video and 64MP burst images simultaneously. Qualcomm says the ISP can process images up to 200MP in size. This is not just a theoretical number, either, as Qualcomm says that smartphone image sensor vendors are indeed working on sensors with these ridiculously high megapixel counts. In more practical terms, however, the Spectra 480 is now capable of processing 64MP images with Zero Shutter Lag (from a single sensor.) That’s up from 48MP @ ZSL with the Snapdragon 855.

The Snapdragon 865 is also significantly more capable at video processing than the Snapdragon 855. For starters, the Snapdragon 865 now supports 8K resolution at 30fps. Next, the Spectra 480 is able to support 960fps slow motion videos at 720p resolution – without any time limits. 120fps slow motion at 4K video resolution is also possible. Lastly, the Spectra 480 now supports video capture in Dolby Vision HDR, even processing and converting colors on-the-fly, though OEMs will likely need to pay a licensing fee for it.

Connectivity

Modem

At last year’s Snapdragon Tech Summit, Qualcomm dedicated the entire first day to 5G. When they did so, 5G was still just a tech demo in our minds. Fast forward a year and we’ve seen both mmWave and sub-6 GHz 5G networks out in the real-world. In their rush to be the first to market, smartphone makers packed their first generation of 5G-enabled smartphones with Qualcomm’s years-old Snapdragon X50 5G modem. The X50 is certainly capable of impressive speeds, but it is manufactured using an older, less efficient process and supports fewer modes than the newer Snapdragon X55 modem.

The Snapdragon X55 was announced earlier this year as a 2G/3G/4G/5G multi-mode modem manufactured on a newer 7nm manufacturing process. It supports theoretical download and upload speeds of up to 7.5Gbps and 3.0Gbps respectively, Dynamic Spectrum Sharing (DSS), global 5G roaming, and 5G multi-SIM connectivity. In addition, the Snapdragon X55 supports SA (Standalone) 5G networks, mmWave and sub-6GHz in FDD frequencies, and has double the bandwidth at sub-6GHz frequencies. The Snapdragon X55 is, therefore, not only faster and more power efficient than the Snapdragon X50, but it also doesn’t need to be paired with a separate modem for 4G connectivity.

Qualcomm Snapdragon X55 and QTM525 mmWave antenna

While the Qualcomm Snapdragon 865 does support the Snapdragon X55 modem, it does not have this modem integrated into the SoC. We’ll likely see that happen with the next generation 800 series SoC. Furthermore, the Snapdragon X55 still requires the inclusion of Qualcomm’s QTM525 or QTM527 mmWave antennas in order to support mmWave 5G networks.

WiFi and Bluetooth

The Wi-Fi Alliance finalized the 802.11ax standard, better known as the Wi-Fi 6 specification, a while back, but so far, only the Samsung Galaxy S10 series and the Samsung Galaxy Note 10 series are Wi-Fi 6 certified. The Wi-Fi modem in the Snapdragon 855, contained in the Qualcomm FastConnect 6200 mobile connectivity subsystem, is “Wi-Fi 6 ready,” according to Qualcomm, while the new FastConnect 6800 in the Snapdragon 865 is “Wi-Fi Certified 6.” Whether that means all devices with the Snapdragon 865 will support Wi-Fi 6 remains to be seen, but at the very least, the FastConnect 6800 does bring new Wi-Fi features like OFDMA (Orthogonal frequency-division multiple access) to reduce network congestion and 1024QAM (Quadrature amplitude modulation) to improve throughput.

Bluetooth connectivity is also receiving a slight upgrade this generation. The FastConnect 6800 in the Snapdragon 865 now supports Bluetooth 5.1 as opposed to Bluetooth 5.0 in the Snapdragon 855’s FastConnect 6200. Version 5.1 of the specification notably introduces angles of arrival and departure for more precise, localized tracking of devices.

The Snapdragon 865 also supports Qualcomm’s new aptX Voice, a subset of the aptX Adaptive Bluetooth audio codec, allowing for Super Wide Band (32kHz) voice over Bluetooth for “a new class of crystal clear audio.” A newer version of aptX Adaptive supports 24-bit 96kHz audio and a bitrate of over 600kbps. Both OEMs and Bluetooth accessory makers will have to license aptX Voice and/or aptX Adaptive revision 2 for use in smartphones and accessories, respectively.

Memory

Companies like Samsung are finally mass producing LPDDR5 RAM modules for mobile devices, so it’s no surprise that the Snapdragon 865 supports LPDDR5 memory at up to 2750MHz. LPDDR5 is the latest specification that implements features like a dual differential clock system for increasing the frequency without increasing the pin count, a new deep sleep mode for better power consumption, and Link ECC to recover data from failed Read/Write operations.

Since apps and games are constantly swapped in and out of RAM, having faster RAM will result in faster app switching. Just like with the move from UFS 2.1 to UFS 3.0 storage, we won’t know how much a theoretical bump in memory performance will actually end up mattering. Expect to see premium flagship smartphones, likely from Samsung or OnePlus, to be the first to market with LPDDR5 RAM.

Charging

Qualcomm’s latest fast charging technology has, unfortunately, not made its way to the Snapdragon 865. Qualcomm’s Quick Charge 4+ is still available – so long as the OEM licenses it – for up to 27W of fast wired charging. While the charging speed won’t be getting a bump, the battery longevity might be. Qualcomm’s new Quick Charge AI promises the extension of battery life cycles so you can keep using your device for longer without having to buy a new phone or swap the battery (which is mostly impossible to do these days.)

We don’t have details on how Quick Charge AI extends the battery longevity, but it’s possibly dynamically adjusting the voltage like USB Power Delivery’s Programmable Power Supply (PPS). Compared to a similar device with the Snapdragon 730, Qualcomm says a device with the Snapdragon 765 and Quick Charge AI can last up to 200 additional battery life cycles. Comparable figures were not provided for the Snapdragon 855 versus Snapdragon 865, but we can guess they’ll be similar.

Qualcomm Snapdragon 865 complete feature list. Click to expand.

Artificial Intelligence

  • Adreno 650 GPU
  • Kryo 585 CPU
  • Hexagon 698 Processor
    • Hexagon Tensor Accelerator
    • Hexagon Vector eXtensions
    • Hexagon Scalar Accelerator
  • Qualcomm Sensing Hub
    • Ultra low power hub for audio, voice and sensors
    • Supports AI algorithms at low power
    • Support for fusing contextual data streams including sensors, audio and voice
    • Supports multiple voice assistants
    • Always-on multi-mic far-field detection and echo cancellation

5G Modem-RF System

  • Snapdragon X55 5G Modem-RF System
  • 5G mmWave and sub-6 GHz, standalone (SA) and non-standalone (NSA) modes, FDD, TDD
  • Dynamic Spectrum Sharing
  • mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
  • Sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
  • Qualcomm® 5G PowerSave
  • Qualcomm® Smart Transmit™ technology
  • Qualcomm® Wideband Envelope Tracking
  • Qualcomm® Signal Boost adaptive antenna tuning
  • Global 5G multi-SIM
  • Downlink: Up to 7.5 Gbps
  • Uplink: Up to 3 Gbps (5G)
  • Multimode support: 5G NR, LTE including CBRS, WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

Wi-Fi & Bluetooth

  • Qualcomm® FastConnect™ 6800 Subsystem
    • Wi-Fi Standards: Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g/n
    • Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
    • Peak speed: 1.774 Gbps
    • Channel Utilization: 20/40/80 MHz
    • 8-stream sounding (for 8×8 MU-MIMO) MIMO Configuration: 2×2 (2-stream)
    • MU-MIMO (Uplink & Downlink)
    • 1024 QAM (2.4 & 5 GHz)
    • OFDMA (2.4 and 5 GHz)
    • Dual-band simultaneous (DBS)
    • Wi-Fi Security: WPA3-Enterprise, WPA3- Enhanced Open, WPA3 Easy Connect, WPA3-Personal
  • Integrated Bluetooth
    • Bluetooth Version: Bluetooth 5.1
    • Bluetooth features: 1-to-many Bluetooth broadcast, up to 18dB link margin improvement
    • Bluetooth audio: Qualcomm® aptX™ Voice audio for super wide band voice calls, Qualcomm aptX Adaptive audio for robust, low latency, high quality audio, Qualcomm TrueWireless™, Qualcomm TrueWireless Stereo
  • Qualcomm 60 GHz Wi-Fi
    • Wi-Fi Standards: 802.11ad, 802.11ay
    • Wi-Fi Spectral Band: 60 GHz
    • Peak speed: 10 Gbps
    • Always-on ambient Wi-Fi sensing

Camera

  • Qualcomm® Spectra™ 480 Image Signal Processor
  • Dual 14-bit ISPs
  • Up to 2 gigapixels per Second
  • Hardware accelerator for computer vision (CV-ISP)
  • Up to 200 Megapixel Photo Capture
  • Up to 25 MP dual camera with Zero Shutter Lag
  • Up to 64 MP single camera with Zero Shutter Lag
  • Rec. 2020 color gamut video capture
  • Up to 10-bit color depth video capture
  • 4K Video Capture + 64MP Photo (5 burst)
  • 8K Video Capture
  • Slow motion video capture at 720p at 960fps
  • HEIF: HEIC photo capture, HEVC video capture
  • Video Capture Formats: HDR10+, HDR10, HLG, Dolby Vision
  • 4K Video Capture at 120fps
  • 4K HDR Video Capture with Portrait Mode (Bokeh)
  • Multi-frame Noise Reduction (MFNR)
  • Real-time object classification, segmentation and replacement

Audio

  • Hexagon Voice Assistant Accelerator for hardware accelerated voice signal processing
  • Qualcomm Aqstic™ audio codec (Up to WCD9385)
    • Total Harmonic Distortion + Noise (THD+N), Playback: -108dB
    • Native DSD support, PCM up to 384 kHz/32-bit
    • Customizable “Golden Ears” filter
  • Qualcomm Aqstic smart speaker amplifier (up to WSA8815)

Display

  • On-Device Display Support:
    • 4K at 60Hz
    • QHD+ at 144Hz
  • Maximum External Display Support: up to 4K at 60Hz
  • 10-bit color depth, Rec. 2020 color gamut
  • HDR10 and HDR10+

CPU

  • Qualcomm Kryo 585, Octa-core CPU
  • Up to 2.84 GHz
  • 64-bit Architecture

Visual Subsystem

  • Adreno 650 GPU
  • Vulkan® 1.1 API support
  • HDR gaming (10-bit color depth, Rec. 2020 color gamut)
  • Physically Based Rendering
  • API Support: OpenGL® ES 3.2, OpenCL™ 2.0 FP, Vulkan 1.1
  • Hardware-accelerated H.265 and VP9 decoder
  • HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision

Security

  • Secure Processing Unit: Mobile Payment, Dual SIM/Dual Standby
  • Qualcomm® 3D Sonic Sensor
  • Biometric Authentication: Fingerprint, Iris, Voice, Face
  • On-Device: Qualcomm® Mobile Security, Key Provisioning Security, Qualcomm® Processor Security, Qualcomm® Content Protection, Qualcomm® Trusted Execution Environment, Camera Security, Crypto Engine, Malware Protection, Secure Boot, Secure Token

Charging

  • Qualcomm Quick Charge 4+ technology
  • Qualcomm Quick Charge AI

Location

  • GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
  • Dual Frequency Support
  • Low Power Geofencing and Tracking, Sensorassisted Navigation
  • Near Field Communications (NFC): Supported

Memory

  • Support for LP-DDR5 memory up to 2750MHz
  • Support for LPDDR4x memory up to 2133 MHz
  • Memory Density: up to 16 GB

General Specifications

  • Full Suite Snapdragon Elite Gaming features
  • 7nm Process Technology
  • USB Version 3.1; USB Type-C Support
  • Part Number: SM8250

The smartphone industry has progressed rapidly this year, and the new Snapdragon 865 reflects those changes. 5G, high refresh rate displays, high megapixel cameras, and AI features will only continue to get more powerful and sophisticated, and Qualcomm’s latest premium SoC seems ready to handle the upcoming 2020 flagship smartphones. Xiaomi, OPPO, HMD Global (makers of Nokia-branded smartphones), and Motorola have already confirmed their plans on launch smartphones with the Snapdragon 865 mobile platform.

Qualcomm isn’t the only player out there with a premium SoC, however. MediaTek’s Dimensity 1000, Huawei’s HiSilicon Kirin 990, and Samsung’s Exynos 990 are all in the same tier as Qualcomm’s Snapdragon 865, so we’ll have to wait for commercial products to start shipping before we can declare one of these as the best mobile SoC.

The post Qualcomm announces the Snapdragon 865 with support for 5G, 200MP cameras, and 144Hz displays appeared first on xda-developers.

Qualcomm announces the Snapdragon 765 with the Snapdragon X52 5G modem and support for 120Hz displays and 192MP cameras

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Facing increased competition from MediaTek, Huawei, and Samsung in price and spec-conscientious markets like India and China, Qualcomm created a new Snapdragon 700 series of upper mid-range chipsets last year. The 700 series brings the best of Qualcomm’s premium 800 series but at a lower price point. The most recent iteration, the Snapdragon 730, even introduced a gaming variant to meet the growing demand of the mobile gaming industry. Now, Qualcomm is once again introducing a new member to the 700 series: the Qualcomm Snapdragon 765. The new SoC brings support for 5G connectivity, high refresh rate displays, and high-quality imaging to the mid-range price tier.

In India, China, and other parts of Asia, phone makers like Xiaomi, Realme, OPPO, Huawei/Honor, Vivo, Lenovo/Motorola, and Samsung are locked in a competition to see who can deliver the best specifications at the best price. The cost of the SoC, of course, factors into how low a brand can price their smartphone, which is why we see a lot of mid-range smartphones with Qualcomm’s latest 600 series SoC or one of MediaTek’s Helio P series SoCs.

In between this range and the premium flagship tier is where the upper mid-range devices like the Xiaomi Mi 9T, Realme X2, Redmi Note 8 Pro, Xiaomi Mi Note 10, Honor 9X, and Samsung Galaxy A80 come in. These devices have features that were previously exclusive to the flagship tier, such as 3+ cameras, an ultra high-resolution main camera, 6+GB of RAM, and very fast wired charging. With the Qualcomm Snapdragon 765, next year’s upper mid-range devices could have features like 120Hz displays, 5G network support, 12GB of RAM, super slow motion video, and more. Here’s how the Snapdragon 765 could make that happen.

Disclaimer: Qualcomm sponsored my trip to Maui, Hawaii, to attend the Snapdragon Tech Summit. The company paid for my flight and hotel. However, they did not have any input regarding the content of this article.

To begin with, here’s a table I made compares the Snapdragon 730 with the new Qualcomm Snapdragon 765. The table may be hard to follow if you’re not already familiar with most of the terms. Underneath the table, I have provided explanations of all the year-on-year improvements and new features.

Qualcomm Snapdragon 730 (sm7150-AA) Qualcomm Snapdragon 765 (sm7250-AA)
CPU 2x Kryo 470 (ARM Cortex-A76-based) Performance cores @ 2.2GHz

6x Kryo 470 (ARM Cortex-A55-based) Efficiency cores @ 1.8GHz

1x Kryo 475 (ARM Cortex-A76-based) Prime core @ 2.3GHz (2.4GHz on 765G)

1x Kryo 475 (ARM Cortex-A76-based) Performance core @ 2.2GHz

6x (ARM Cortex-A55-based) Efficiency cores @ 1.8GHz

GPU Adreno 618 @ 500MHz
Vulkan 1.1
Video playback: H.264 (AVC), H.265 (HEVC), VP8, VP9, 4K HDR10 PQ, HLG
Adreno 620 (15% speed-binned GPU on 765G)
Vulkan 1.1
Video playback: H.264 (AVC), H.265 (HEVC), VP8, VP9, 4K HDR10, HLG, HDR10+, Dolby Vision
Select Snapdragon Elite Gaming Features (765G only)
20% better performance and efficiency
Display Maximum On-Device Display Support: FHD+ @ 120Hz
Maximum External Display Support: UHD @ 60Hz
HDR support
DisplayPort over USB Type-C support
Maximum On-Device Display Support: FHD+ @ 120Hz, QHD+ @ 60Hz
Maximum External Display Support: UHD @ 60Hz
HDR support
DisplayPort over USB Type-C support
AI Hexagon 688 with Hexagon Vector eXtensions and Hexagon Tensor Accelerator
4th generation AI Engine
Hexagon 696 with Hexagon Vector eXtensions and new Hexagon Tensor Accelerator
5th generation AI Engine
Qualcomm Sensing Hub
5.5 TOPS (765G)
Memory Type: 2 x 16-bit, LPDDR4
Speed: Up to 1866MHz, 8GB RAM
Type: 2 x 16-bit, LPDDR4
Speed: Up to 2133MHz, 12GB RAM
1MB system cache
ISP Dual 14-bit Spectra 350 ISP
Single camera: Up to 36MP with ZSL; Up to 192MP
Dual camera: Up to 22MP with ZSL
Video capture: 4K HDR @ 30 fps video; Slow motion up to 720p@240 fps; HDR10, HLG
Dual 14-bit Spectra 355 ISP
Single camera: Up to 36MP with ZSL; Up to 192MP
Dual camera: Up to 22MP with ZSL
Video capture: 4K HDR @ 30 fps video; Slow motion up to 720p@480 fps; HDR10, HDR10+, HLG
Modem Snapdragon X15 LTE modem
Downlink: 800Mbps (4G LTE)
Uplink: 150Mbps (4G LTE)
Snapdragon X52 4G LTE and 5G multimode modem
Downlink: 3.7Gbps (5G), 1.2Gbps (4G LTE)
Uplink: 1.6Gbps (5G), 210Mbps (4G LTE)
Modes: NSA, SA, TDD, FDD
mmWave: 400MHz bandwidth, 8 carriers, 2×2 MIMO
sub-6 GHz: 100MHz bandwidth, 4×4 MIMO
Charging Qualcomm Quick Charge 4+ Qualcomm Quick Charge 4+
Qualcomm Quick Charge AI
Connectivity Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS

Wi-Fi: Wi-Fi 6; 2.4/5GHz Bands; 20/40/80 MHz Channel; DBS, TWT, WPA3, 8×8 MU-MIMO

Bluetooth: Version 5.0, aptX TWS and Adaptive

Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS, Dual Frequency support

Wi-Fi: Qualcomm FastConnect 6200; Wi-Fi 6 ready; 2.4/5GHz Bands; 20/40/80 MHz Channels; DBS, TWT, WPA3, 8×8 MU-MIMO

Bluetooth: Version 5.0, aptX TWS and Adaptive

Manufacturing Process 8nm LPP from Samsung 7nm EUV from Samsung

Qualcomm Snapdragon 765 SoC

CPU

The Snapdragon 765 features minor improvements in CPU performance compared to the Snapdragon 730. That’s because there aren’t any major architectural changes to the CPU cores. Instead, Qualcomm added a new “Prime” CPU core cluster consisting of a lone core clocked at up to 2.3GHz. There’s also a lone “Performance” core clocked at up to 2.2GHz. Qualcomm says these two cores are based on its customized Kryo 475 architecture, which is derived from the ARM Cortex-A76 design. Lastly, there are 6 ARM Cortex-A55-based Efficiency CPU cores clocked at up to 1.8GHz. Thus, the core cluster configuration of the Snapdragon 765 is 1+1+6 compared to 2+6 on the Snapdragon 730.

It is likely that the transition from an 8nm manufacturing process to a 7nm manufacturing process yields some improvements in CPU power efficiency, and thus, average performance.

GPU

Qualcomm’s new Adreno 620 GPU in the Snapdragon 765 supposedly offers 20% better performance and efficiency compared to the Adreno 618 GPU in the Snapdragon 730. We don’t know the maximum clock speed of the GPU or any other details that might explain the increase in performance and efficiency, but again, it’s likely that the transition from an 8nm to a 7nm manufacturing process yielded some benefits in those regards.

Qualcomm added support for HDR10+ and Dolby Vision video playback in the Adreno 620. The Adreno 618, in comparison, only supported 4K HDR10 PQ.

Display

One of the best capabilities of the new Snapdragon 765, according to Qualcomm, is the fact that it supports on-device displays up to FHD+ resolution and a 120Hz refresh rate. The GPU is largely responsible for pushing pixels to the display, and with higher resolutions and refresh rates, there are a lot more pixels to push.

So far, high refresh rate panels have been exclusively found in premium flagship smartphones. However, the Snapdragon 835-powered Razer Phone had a 120Hz display back in 2017, and this year alone we’ve seen nearly a dozen smartphones with high refresh rate displays. It’s only a matter of time until the first upper mid-range device launches with one, and when it does, it’ll likely be powered by the Qualcomm Snapdragon 765. Interestingly, Qualcomm confirmed to us that the GPU in the Snapdragon 730 is already capable of supporting FHD+ @ 120Hz, but we don’t know how much more capable the Snapdragon 765 is at sustaining 120fps than the Snapdragon 730.

AI

Qualcomm’s advancements in on-device artificial intelligence are best seen each year in the new Snapdragon 800 series, but the company has been bringing some of these advancements down to the Snapdragon 700 series as well. Qualcomm doubled the AI performance of the Snapdragon 730 versus the Snapdragon 710 by introducing their 4th generation AI Engine, adding more ALUs in the GPU, improving dot product instruction performance in the CPU, and adding their Hexagon Tensor Accelerator (HTA).

Qualcomm is continuing to improve the AI performance in the Snapdragon 700 series with the introduction of their 5th generation AI Engine and a newer Hexagon Tensor Accelerator in the Snapdragon 765. Overall, the Snapdragon 765G SoC is capable of 5.5 TOPS (trillions of operations) performance, closing in on the Snapdragon 855’s 7 TOPS performance.

A discrete component called the “Qualcomm Sensing Hub” has also been announced. The Sensing Hub is designed for always-on detection of audio with support for multiple hotwords such as “Hey/Okay Google” and “Alexa.” Utilizing <1 mW of power, the chip’s power drain is basically negligible. As the sensor’s framework is scalable, developers can use Qualcomm’s Hexagon SDKs to create their own audio-activated features.

ISP

While the Spectra ISP in the Snapdragon 800 series has received a huge bump in performance and functionality with this generation, the improvements in the Snapdragon 700 series are more modest. As far as we can tell, Qualcomm hasn’t disclosed any notable improvements in photography. Qualcomm boasts that the Snapdragon 765’s Spectra 355 ISP is capable of processing 192MP photos, but without ZSL at that resolution, don’t expect smartphone makers to ever allow you to capture full 192MP photos. Qualcomm did state that camera vendors are working on image sensors with these ultra high megapixel counts, though.

What we do know has changed in this generation is video capture. The Spectra 355 is capable of processing slow motion 720p videos at 480fps compared to the Spectra 350’s 720p@240fps support. In addition, the Spectra 355 adds support for video capture in HDR10+.

Connectivity

Modem

Qualcomm is aggressively positioning itself at the forefront of 5G technology, and they’re banking on the Snapdragon 765 to bring 5G-enabled smartphones to the masses. The Snapdragon 765 is Qualcomm’s first SoC with integrated 5G, meaning the 5G modem is on the die. This results in lower power consumption as the smartphone won’t have to provide power for a discrete modem. However, that doesn’t mean the Snapdragon 765 is superior at 5G connectivity compared to the Snapdragon 865.

The Snapdragon X52, like the Snapdragon X55, is a multi-mode modem, meaning it is capable of 2G, 3G, 4G LTE, and 5G (sub-6GHz and mmWave) connections. When comparing the specifications of the two modems, however, you’ll find that the Snapdragon X52 offers half the maximum theoretical 5G download speed (3.7Gbps vs 7.5Gbps), half the maximum theoretical 5G upload speed (1.6Gbps vs 3.0Gbps), half the mmWave bandwidth (400MHz vs 800MHz), and half the sub-6GHz bandwidth (100MHz vs 200MHz) compared to the discrete Snapdragon X55 modem paired with the Snapdragon 865. It’s a similar story for the 4G LTE speeds.

Snapdragon X52 modem

Yet, the mmWave 5G network roll out is still underway, so most users won’t be seeing 5G speeds that are anywhere close to the theoretical maximums anyway. What’s more important about the Snapdragon X52 is the fact that it supports global bands and has all the technology that Qualcomm has developed to improve throughput, reliability, and usability. Technologies like Dynamic Spectrum Sharing, global 5G roaming, multi-SIM 5G, 5G PowerSave, and Qualcomm Wideband Envelope Tracking are all implemented in the Snapdragon X52 modem, just to name a few.

Location

Like the latest 800 series chipsets, the Snapdragon 765 supports dual frequency GNSS, which can result in more precise location tracking if the smartphone has a chip capable of supporting multiple frequencies (L1+L5 or E1+E5a). This is the first Snapdragon 700 series chipset that supports this functionality.

Memory

As we’ve seen in some recent flagship devices, 4GB of RAM may not be enough to handle complex camera processing while having high-end mobile games and other apps in the background without killing one or more of these processes. The Snapdragon 730 already supports memory chips with a capacity of up to 8GB, but now the Snapdragon 765 supports a memory capacity of up to 12GB! Even better, the 765 supports memory speeds up to 2133MHz, a 267MHz increase over the 730. The increase in memory speeds may not account for much, but an extra 4GB of RAM can go a long way. Meanwhile, the premium Snapdragon 865 now supports LPDDR5 memory, thus raising the bar that the Snapdragon 700 series has to meet. Maybe next year.

Charging

Qualcomm’s latest fast charging technology is still a work-in-progress, it seems, as 27W Quick Charge 4+ is still the fast charge technology of choice for the Snapdragon 765. However, Qualcomm has added a new “Quick Charge AI” technology that supposedly extends the longevity of your smartphone’s battery. Compared to the Snapdragon 730, a device with the Snapdragon 765 will last for up to 200 more battery life cycles. Qualcomm did not share many details on how Quick Charge AI works, but it could be using dynamic voltage adjustment like USB-PD PPS (USB-Power Delivery Programmable Power Supply.)

But wait, there’s more! Meet the Qualcomm Snapdragon 765G

Qualcomm Snapdragon 765G logo

Catering to mobile gamers, Qualcomm again designed a variant of its latest Snapdragon 700 series chip with slightly more power and some gaming-centric features. The Snapdragon 765G is basically identical to the Snapdragon 765, but it has the following advantages:

  • Slightly higher single-core CPU performance (Prime core clock speed increased from 2.3 GHz to 2.4 GHz)
  • Slightly faster GPU performance (15% speed-binned)
  • Select Snapdragon Elite Gaming features (Game Smoother, Game Fast Loader, Game Network Latency Manager, Jank Reducer 2.0, Predictive Game Auto Tuner)

Qualcomm Snapdragon 765 complete feature list. Click to expand.

Qualcomm AI Engine

  • Adreno 620 GPU (15% speed-binned GPU on 765G)
  • Qualcomm® Kryo™ 475 CPU
  • Hexagon 696 Processor
  • Hexagon Vector eXtensions
  • Hexagon Tensor Accelerator
  • Qualcomm Sensing Hub
    • Ultra low power hub for audio, voice and sensors
    • Supports AI algorithms at low power
    • Support for fusing contextual data streams including sensors, audio and voice
    • Supports multiple voice assistants
    • Always-on multi-mic far-field detection and echo cancellation

5G Modem-RF System

  • Snapdragon X52 5G Modem-RF System – Modem to antenna integrated system for 5G multimode
  • 5G mmWave and sub-6 GHz, standalone (SA) and non-standalone (NSA) modes, FDD, TDD
  • Dynamic Spectrum Sharing
  • mmWave: 400 MHz bandwidth, 2×2 MIMO
  • Sub-6 GHz: 100 MHz bandwidth, 4×4 MIMO
  • Qualcomm® 5G PowerSave
  • Qualcomm® Smart Transmit™ technology
  • Qualcomm® Wideband Envelope Tracking
  • Qualcomm® Signal Boost adaptive antenna tuning
  • Global 5G multi-SIM
  • Downlink: Up to 3.7 Gbps (5G), 1.2 Gbps (LTE)
  • Uplink: Up to 1.6 Gbps (5G), 210 Mbps (LTE)
  • Multimode support: 5G NR, LTE including CBRS, WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

Wi-Fi & Bluetooth

  • Qualcomm® FastConnect™ 6200 Subsystem
    • Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    • Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
    • Channel Utilization: 20/40/80 MHz
    • MIMO Configuration: 2×2 (2-stream) with MU-MIMO
    • 8-stream sounding (for 8×8 MU-MIMO)
    • Dual-band simultaneous (DBS)
    • Wi-Fi Security: WPA3-Enterprise, WPA3- Enhanced Open, WPA3 Easy Connect, WPA3-Personal
    • Target Wake Time (TWT)
  • Integrated Bluetooth
    • Bluetooth version: 5.0
    • Bluetooth Speed: 2 Mbps
    • Bluetooth audio: Qualcomm TrueWireless™ Technology, Qualcomm aptX Adaptive

Camera

  • Qualcomm® Spectra™ 355 Image Signal Processor
  • Dual 14-bit ISPs
  • Hardware accelerator for computer vision (CV-ISP)
  • Up to 192 MP capture
  • Up to 22 MP dual camera with Zero Shutter Lag
  • Up to 36 MP single camera with Zero Shutter Lag
  • Rec. 2020 color gamut video capture
  • Up to 10-bit color depth video capture
  • Slow motion video capture at 720p at 480fps
  • HEIF: HEIC photo capture, HEVC video capture
  • Video Capture Formats: HDR10+, HDR10, HLG
  • 4K HDR Video Capture with Portrait Mode (Bokeh)
  • Multi-frame Noise Reduction (MFNR)
  • Real-time object classification, segmentation and replacement

Audio

  • Hexagon Voice Assistant Accelerator for hardware accelerated voice signal processing
  • Qualcomm Aqstic™ audio codec (up to WCD9385)
    • Total Harmonic Distortion + Noise (THD+N), Playback: -108dB
    • Native DSD support, PCM up to 384 kHz/32-bit
    • Customizable “Golden Ears” filter
  • Qualcomm Aqstic smart speaker amplifier (up to WSA8815)

Display

  • On-Device Display Support:
    • QHD+ at 60Hz
    • FHD+ at 120Hz
  • Maximum External Display Support: UHD at 60Hz
  • 10-bit color depth, Rec. 2020 color gamut
  • HDR10 and HDR10+

CPU

  • Kryo 475, Octa-core CPU
  • Up to 2.3 GHz (765)
  • Up to 2.4GHz (765G)
  • 64-bit Architecture

Visual Subsystem

  • Adreno 620 GPU
  • Vulkan® 1.1 API support
  • 4K HDR10 PQ and HLG Video Playback (10 bit color depth, Rec. 2020 color gamut)
  • H.264 (AVC), H.265 (HEVC) VP8 and VP9 playback
  • Physically Based Rendering
  • API Support: OpenGL® ES 3.2, OpenCL™ 2.0 FP, Vulkan 1.1, DirectX 12

Security

  • Biometric Authentication: Fingerprint, Iris, Voice, Face
  • On-Device: Qualcomm® Mobile Security, Key Provisioning Security, Qualcomm® Processor Security, Qualcomm® Content Protection, Qualcomm® Trusted Execution Environment, Camera Security, Crypto Engine, Malware Protection, Secure Boot, Secure Token

Charging

  • Qualcomm Quick Charge 4+ technology
  • Qualcomm Quick Charge AI

Location

  • GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
  • Dual Frequency Support
  • Low Power Geofencing and Tracking, Sensor-assisted Navigation

General Specifications

  • Select Snapdragon Elite Gaming features including: Game Smoother, Game Fast Loader, and Game Network Latency Manager (765G)
  • Memory Speed: up to 2133 MHz, 12 GB RAM
  • Memory Type: 2 x 16-bit, LPDDR4x
  • Near Field Communications (NFC) support
  • DisplayPort over USB Type-C support
  • 7nm. Process Technology
  • Part Number: SM7250-AA (765)
  • Part Number: SM7250-AB (765G)

Mobile devices powered by the Snapdragon 765 series will be announced later this year and throughout 2020. Xiaomi’s Redmi K30 and OPPO’s Reno3 Pro have been confirmed to utilize the Snapdragon 765G, while HMD Global and Motorola have confirmed that they’re working on smartphones based on the 765 or 765G mobile platform. Devices with this SoC will mainly be sold in markets like India and China where mobile gaming is a huge market and smartphone competition is fierce, but we can expect to see at least a few devices powered by these chipsets to land in Europe.

The post Qualcomm announces the Snapdragon 765 with the Snapdragon X52 5G modem and support for 120Hz displays and 192MP cameras appeared first on xda-developers.

Qualcomm Snapdragon 865’s SPU has integrated Dual SIM, Dual Standby and supports saving driver’s licenses in Android 11

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Earlier today, Qualcomm revealed the full specifications and features of their latest premium Snapdragon 800 series SoC: the Qualcomm Snapdragon 865 mobile platform. We covered all of the major details you need to know in that article, but as always, there are smaller tidbits of information that were revealed during the keynote. During the keynote, Jesse Seed, a senior director of product management at Qualcomm, talked about some of the new security features in the Snapdragon 865. Notably, the Secure Processing Unit (SPU), the on-die secure element responsible for protecting biometric credentials, payment information, and SIM data, now fully supports dual SIM, dual standby and Android 11’s upcoming IdentityCredential API.

Integrated Dual SIM, Dual Standby

Android smartphones with eSIMs are still scarce, though there are a few on the market, including the Pixel 2, Pixel 3, Pixel 3a, Pixel 4, Galaxy Fold, and the Motorola Razr. Storing SIM card data requires secure hardware, which for most devices means needing a dedicated chip. For the Pixel 2, that’s the ST Microelectronics ST33G1M2 32 bit MCU with ARM SecurCore SC300, according to iFixit’s teardown. The Secure Processing Unit on the Snapdragon 855, however, has smartcard equivalent EAL4+ certification, meaning it’s been deemed secure enough to handle SIM data. Qualcomm partnered with a company called Gemalto to enable eSIM support in the Snapdragon’s Secure Processing Unit.

Qualcomm Snapdragon 865 Dual SIM, Dual Standby support in the Secure Processing Unit

Expanding on this work is the announcement that the SPU in the Snapdragon 865 now fully supports dual SIM, dual standby (DSDS). This means that not only can the SPU store eSIMs provisioned from more than one carrier, but the secondary, inactive eSIM can still receive calls and texts.

Support for Android 11’s IdentityCredential API

Back in March, Google started working on a new IdentityCredential API. This API allows for storing credentials, such as a driver’s license or passport, electronically on the device. Google announced at I/O 2019 that they’re working with ISO to standardize the implementation of mobile driver’s licenses, and that they’ll develop a Jetpack support library so applications can support asking for identity credentials. Now, Qualcomm has confirmed that the SPU in the Snapdragon 865 supports Google’s IdentityCredential API.

Qualcomm Snapdragon 865 supports Android 11's IdentityCredential API

To be more precise, this announcement likely means that the Snapdragon 865 will support the “direct access” mode mentioned by Google in the IdentityCredential HAL implementation. This mode allows the credential to be pulled up even when there isn’t enough power to boot the main Android OS.

Update: Shawn Willden from Google shared some technical information on how direct access mode may be supported. According to him, it’s unlikely the SPU will support direct access mode since it’s integrated into the SoC. If the secure element were integrated into a discrete chip like the NFC controller, it would be easier to support. However, there’s a possibility that Qualcomm may have found or is working on a way to make this work.

The API is still a work-in-progress but we’re tracking its progress in AOSP. Google plans on releasing this API along with the Jetpack library in the next Android release, which is Android 11.

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Qualcomm Announces Snapdragon XR2 5G Platform for VR and XR Headsets

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Virtual Reality is still an evolving industry, and as the years have gone by, we’ve seen various OEMs experiment with different solutions and form factors. From headsets utilizing the phone’s internals like the original Gear VR to dedicated solutions like the Oculus Go, it seems like mobile VR in particular has been able to capture enough attention and market share to keep evolving and iterating. Qualcomm has been at the forefront of this space directly and indirectly by supplying the chipsets to both dedicated headsets and phones used in “cardboard” or slot-in solutions. It was with the Snapdragon XR1 announced in 2018, though, that we saw this concerted effort really come into focus, and over 30 devices powered by the XR platform have been launched since then.  Today at the Snapdragon Tech Summit, Qualcomm announced the Snapdragon XR2 5G, a direct successor bringing much-needed updates to their eXtended Reality platform.

The Snapdragon XR2 brings several important improvements over the Snapdragon 835-based XR1, which is now several generations behind the performance of the new Snapdragon 865 flagship chipset announced this week. As a result, and by inheriting the advancements brought about by Qualcomm’s premium mobile SoC line-up, the XR2 offers twice the CPU and GPU performance of the original XR platform. The XR2 GPU supports 1.5x the pixel rate and 3x the texel rate, as well as previously introduced features like foveated rendering via eye-tracking and enhanced variable rate shading for smoother refresh rates.

Qualcomm Snapdragon XR2 logo

On top of that, the Snapdragon XR2 brings several other improvements that specifically impact virtual reality experiences. For example, the XR2 will offer up to four times the video bandwidth/pixel throughput, six times higher resolution, and eleven times the AI performance. This means that the XR2 is now capable of up to 3K by 3K resolution per eye at 90 frames per second and can support up to 8K 360° videos at 60 frames per second via both streaming and local playback.

The Snapdragon XR2 supports seven concurrent cameras for even better scene and positional tracking, as well as a dedicated computer vision processor to accelerate key workloads such as scene understanding and reconstruction. This enables highly accurate tracking of the head, lips, and eyes as well as 26-point skeletal hand tracking so that users may precisely interact with the VR world surrounding them. Another important feature is low-latency camera passthrough, which lets developers create new mixed reality experiences by overlaying virtual objects onto a video feed of the real-world.

And if that wasn’t enough, Qualcomm is also offering the option for manufacturers to include 5G connectivity into their Snapdragon XR2-powered headsets. While it might sound like overkill, consider that use cases such as streaming 360° video at high resolutions requires not only extremely fast download speeds, but also very low latencies to accompany the positional tracking.

All of these are massive upgrades over the XR1, but that’s to be expected given that, again, that platform was based on the Snapdragon 835. With that said, Qualcomm chipsets have made their way to a number of impressive mobile VR headsets, and the next wave of devices will benefit tremendously from the performance gains brought by this new upgrade. We can expect OEMs to incorporate the Snapdragon XR2 5G platform into their designs starting next year.


Stay tuned for more Snapdragon Tech Summit coverage, and check out our summary to catch up with every announcement!

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Qualcomm Announces Snapdragon 8c and 7c for Always On, Always Connected PCs

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Last year, Qualcomm announced the Snapdragon 8cx 5G platform, the world’s first 7nm SoC for laptops, in an attempt to capture the growing market of hybrid, thin-and-light always-connected personal computers (ACPCs). This was the latest in a series of Qualcomm chips for ACPC as the company had previously tested the waters with the Snapdragon 850 and Snapdragon 835 Mobile PC platforms. While we saw Snapdragon 835-powered Windows 10 ACPCs as early as 2018, the Snapdragon 850 was even better tailored for Windows on ARM, which was brought about by concerted effort from Microsoft and Qualcomm. Now, at this year’s Snapdragon Tech Summit, the ACPC chipset portfolio is expanding with the announcement of the new Snapdragon 8c and Snapdragon 7c mobile PC platforms.

These mobile processors allow hybrid and thin-and-light laptops to make use of the integrated modem in Snapdragon chips, and also take advantage of the higher power-efficiency for extended battery life. Those looking for ACPC devices usually prioritize mobility and battery life, thus these efficient Qualcomm chipsets with LTE connectivity are a great fit for on-the-go devices. While ACPC use cases do not require a ton of performance, last year’s Snapdragon 8cx brought about a higher power budget and even better efficiency point for impressive results. The 8cx was essentially a larger Snapdragon 855, featuring the same 8th generation Kryo 495 cores in a 4+4 configuration as well as the Adreno 680 GPU. However, it also came with improvements tailored to the form factor, such as double the memory width through a 128-bit wide interface, capable of up to 16GB of LPDDR4X RAM, and more PCIe connections. This new premium computing tier was not meant to replace the Snapdragon 850, but rather coexist with it by giving OEMs more options when picking the right processor for their ACPC.

This new effort by Qualcomm has seen marked success, even subtly making headlines through the Surface Pro X and its Microsoft SQ1 chip, a Snapdragon 8cx derivative with an upgraded Adreno 685 GPU. This is where the Snapdragon 8c and Snapdragon 7c come into play: While 855-based designs have already made their mark in the premium segment through devices like the Surface Pro X (Microsoft SQ1) and the Galaxy Book S (running the 8cx), the Snapdragon 850 chips are due for an update. Thus, Qualcomm has introduced the high-end Snapdragon 8c, which it directly compares with the Snapdragon 850, and the Snapdragon 7c aimed at entry-level devices.

Qualcomm Snapdragon 8c logo

The Snapdragon 8c succeeds the Snapdragon 850, similarly to the 8cx at the time, with a CPU performance boost of up to 30%. Just like the preceding 8cx, the Snapdragon 8c is built on a 7nm manufacturing process. We can’t directly contrast this figure with the gains the 8cx promised over the 850 given that, at the time, Qualcomm had not offered us a percentage improvement figure. Though, expect the 8cx to remain the better-performing solution. It also promises up to 6 TOPS through its updated Qualcomm AI Engine, combining performance gains in CPU, GPU, and DSP. Finally, its integrated Snapdragon X24 LTE modem enables multi-gigabit connectivity with Cat. 20 downlink for download speeds of up to 2Gbps and Cat. 13 uplink for upload speeds of up to 316Mbps.

Qualcomm Snapdragon 8c complete feature list. Click to expand.

  • DirectX® 12 API

  • Advanced Camera and Video capabilities: Cinema core with VP9 & H.265 decoder and 2nd Gen HDR Playback; High efficiency video encoder

  • Dual 4K external displays

  • Connected Standby / Instant On

  • Multi-gigabit speeds for virtually seamless cloud connectivity/computing: up to 2Gbps LTE

  • Location Aware for app accuracy

  • Wi-Fi: MU-MIMO, Multi-gigabit Wi-Fi, Dual-band simultaneous (DBS), Integrated baseband

  • 4th Generation Qualcomm AI Engine

  • Enhanced voice assistant experiences for Alexa and Cortana with Qualcomm Aqstic technology

  • Supports all Windows 10 versions (Enterprise, Pro, Home)

  • Improved crypto-security

  • Remote management and location awareness for enterprise efficiency

  • Advanced location features:

    • Low Power Geofencing and Tracking
    • Sensor-assisted Navigation
    • Pedestrian Navigation
  • Sensors: Qualcomm® All-Ways Aware™ technology

  • Charging: Qualcomm® Quick Charge™ 4+ technology

Qualcomm Snapdragon 8c specifications. Click to expand.

5G

  • 5G Chipset: Qualcomm® Snapdragon™ X55 Modem-RF System
  • 5G Technology: 5G NR
  • 5G Spectrum: 5G/4G spectrum sharing, mmWave, sub-6 GHz
  • 5G Modes: FDD, TDD, SA (standalone), NSA (non-standalone)
  • 5G mmWave specs: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
  • 5G sub-6 GHz specs: 200 MHz bandwidth, 4×4 MIMO
  • 5G Peak Download Speed: 7 Gbps
  • 5G Peak Upload Speed: 3 Gbps
  • 5G RF: 100 MHz envelope tracking, Adaptive antenna tuning

Qualcomm® Artificial Intelligence (AI) Engine

  • AIE DSP: Qualcomm All-Ways Aware™ technology

CPU

  • CPU Clock Speed: Up to 2.45 GHz
  • CPU Cores: Qualcomm® Kryo™ 490 CPU, Octa-core CPU
  • CPU Architecture: 64-bit

Process

  • Process Technology: 7 nm

DSP

  • DSP Technology: Qualcomm® Hexagon™ 690 Processor

Cellular Modem

  • Modem Name: Qualcomm® Snapdragon™ X24 LTE modem

LTE Category

  • Downlink LTE Category: LTE Category 20

LTE Downlink Features

  • Downlink LTE Streams: Maximum 20 spatial streams
  • Downlink Carrier Aggregation: 7×20 MHz carrier aggregation
  • Downlink LTE MIMO: Up to 4×4 MIMO on five carriers, Full-Dimension MIMO (FD-MIMO)
  • Downlink QAM: Up to 256-QAM

LTE Uplink Features

  • Uplink Technology: Qualcomm® Snapdragon™ Upload+
  • Uplink Carrier Aggregation: 3×20 MHz carrier aggregation
  • Uplink LTE Streams: Up to 2x 106Mbps LTE streams
  • Uplink QAM: Up to 256-QAM

LTE Speed

  • LTE Peak Download Speed: 2 Gbps
  • LTE Peak Upload Speed: 316 Mbps

Cellular Technology

  • Cellular Technology: WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
  • LTE Technology: LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast

Wi-Fi

  • Wi-Fi Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
  • Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
  • MIMO Configuration: 2×2 (2-stream)

Bluetooth

  • Bluetooth Version: Bluetooth 5.0

NFC

  • Near Field Communications: Supported

Location

  • Satellite Systems Support: Beidou, Galileo, GLONASS, GPS, QZSS
  • Location Support: Qualcomm® Location
  • Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning)

RF

  • RFFE: Qualcomm® RF Front-End (RFFE) solution, High-power transmit (HPUE), Qualcomm® Adaptive Antenna Tuning

USB

  • USB Version: USB 3.1

Camera

  • Image Signal Processor: Qualcomm Spectra™ 390 image signal processor, Dual 14-bit ISPs
  • Dual Camera: Up to 16 MP
  • Single Camera: Up to 32 MP
  • Video Capture (30 FPS): 4K HDR video capture, 4K Ultra HD video capture
  • Slow Motion Video Capture: 720p @ 480 FPS

Video

  • Video Playback: Up 4K HDR @ 120fps
  • Codec Support: H.265 (HEVC), H.264 (AVC), VP9
  • Video Software: Rec. 2020 color gamut video capture, Up to 10-bits per color video capture

Display

  • Max On-Device Display: 4K Ultra HD
  • Max External Display: Two 4K Displays

General Audio

  • Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® Broadcast Audio technology, Qualcomm Aqstic™ audio technology, Qualcomm® aptX™ audio technology
  • Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® aptX™ HD

Audio Playback

  • Channel output: Surround Sound
  • Speaker protection: Speaker protection

GPU

  • GPU Name: Qualcomm® Adreno™ 675 GPU
  • API Support: DirectX® 12

Memory

  • Memory speed: 2133MHz
  • Memory Type: 4 channels

Storage

  • SSD: NVME SSD
  • UFS: UFS 3.0

Qualcomm Snapdragon 7c logo

The Snapdragon 7c is arguably an even more interesting portfolio addition given it’s aimed at more affordable ACPCs. Its octa-core Kryo 468 CPU cores promise a 25% boost in system performance over competing platforms in the same segment, and up to twice the battery life in day-to-day usage. It also offers the Snapdragon X15 LTE modem for fast connectivity, with LTE download and upload speeds of 800Mbps and 150Mbps, respectively. It features an Adreno 618 GPU as well, putting ahead of the Snapdragon 835 Mobile PC platform but behind the Snapdragon 850. Finally, it promises up to 5 TOPS through its Qualcomm AI engine, putting the CPU, GPU, and DSP gains to good use in AI-accelerated Windows 10 experiences.

Qualcomm Snapdragon 7c complete feature list. Click to expand.

  • Wi-Fi 6 (11ax) ready (8ss and TWT), Advanced DPD, WPA3

  • Multi-Frame Noise Reduction (MFNR) and Multi-Frame Super Resolution (MFSR)

  • Forward-looking Electronic Image Stabilization (EIS)

  • Motion Compensated Temporal filtering (MCTF) for noise-free video capture up to UHD (4K) at 30 FPS

  • Four MIPI CSI PHYs (DPHY 1.2 / CPHY 1.2)

Qualcomm Snapdragon 7c specifications. Click to expand.

Qualcomm® Artificial Intelligence (AI) Engine

  • AIE CPU: Qualcomm® Kryo™ 468 CPU
  • AIE GPU: Qualcomm® Adreno™ 618 GPU

CPU

  • CPU Clock Speed: Up to 2.45 GHz
  • CPU Cores: Qualcomm® Kryo™ 468 CPU, Octa-core CPU
  • CPU Architecture: 64-bit

Process

Process Technology: 8 nm

Qualcomm® FastConnect™ Subsystem

  • Bluetooth Version: Bluetooth 5.1

Cellular Modem

  • Modem Name: Qualcomm® Snapdragon™ X15 LTE modem

LTE Category

  • Downlink LTE Category: LTE Category 15
  • Uplink LTE Category: LTE Category 13

LTE Downlink Features

  • Downlink Carrier Aggregation: 3×20 MHz carrier aggregation
  • Downlink LTE MIMO: Up to 4×4 MIMO on two carriers
  • Downlink QAM: Up to 256-QAM, Up to 64-QAM

LTE Uplink Features

  • Uplink Technology: Qualcomm® Snapdragon™ Upload+
  • Uplink Carrier Aggregation: 2×20 MHz carrier aggregation
  • Uplink QAM: Up to 64-QAM

LTE Speed

  • LTE Peak Download Speed: 800 Mbps, 150 Mbps

Wi-Fi

  • Wi-Fi Standards: 802.11ax (Wi-Fi 6-ready)
  • Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
  • MIMO Configuration: 2×2 (2-stream)
  • Wi-Fi Features: Target Wake-up Time (TWT)

Location

Satellite Systems Support: NavIC, Beidou, Galileo, GLONASS, GPS, QZSS, SBAS

Camera

  • Image Signal Processor: Qualcomm Spectra™ 255 image signal processor, 14-bit
  • Dual Camera, ZSL, 30fps: Up to 16 MP
  • Single Camera, ZSL, 30fps: Up to 32 MP
  • Camera Features: Multi-frame Noise Reduction (MFNR)
  • Video Capture Features: Rec. 2020 color gamut video capture, Up to 10-bit color depth video capture

Video

  • Video Playback: Up to 4K HDR10
  • Codec Support: H.265 (HEVC), H.264 (AVC), VP9
  • Video Software: Motion Compensated Temporal Filtering (MCTF)

Display

  • Max On-Device Display: QXGA @ 60Hz, FHD @ 60Hz
  • Max External Display: QHD @ 60Hz
  • Display Pixels: 2560×1440, 2048×1536

General Audio

  • Qualcomm Aqstic™ technology: Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier
  • Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® aptX™ HD

Audio Playback

  • PCM, Playback: Up to 384kHz/32bit
  • Additional Playback Features: Native DSD support

Security Support

  • Wi-Fi Security: WPA3

Memory

  • Memory speed: 2133MHz
  • Memory Type: 2x16bit, LPDDR4
  • RAM: 10 GB RAM

Storage

  • UFS: UFS 3.0

Notably absent from these chipsets is 5G connectivity, though this may not be too surprising considering that the 8cx already fulfills that role for the few premium-tier devices aiming for that functionality (855-based ACPCs like the Surface Pro X and Galaxy Book S skipped 5G anyway). According to Patrick Moorhead, Founder and President at Moor Insights & Strategy,  Qualcomm is targeting the Snapdragon 7c to the sub-$400 price point and the Snapdragon 8c to the $400-$800 price point, with the Snapdragon 8cx filling the above-$800 premium tier. Devices with the two new platforms are expected to launch in the first half of 2020.


Stay tuned for more Snapdragon Tech Summit coverage, and check out our summary to catch up with every announcement!

The post Qualcomm Announces Snapdragon 8c and 7c for Always On, Always Connected PCs appeared first on xda-developers.

Qualcomm Snapdragon 865 Benchmarks: Comparing CPU and GPU Performance with the Kirin 990, Snapdragon 855, and Snapdragon 845

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Nearly two weeks ago, Qualcomm invited tech journalists to Maui for the 2019 Snapdragon Tech Summit. At the event, the company unveiled its latest high-end SoC for mobile devices: the Qualcomm Snapdragon 865 mobile platform. Qualcomm says the new Snapdragon 865 boasts a 25% CPU performance increase and a 20% GPU performance increase over the previous generation Snapdragon 855. Also, the new SoC supports LPDDR5 memory and is manufactured on a newer 7nm process. Qualcomm’s latest silicon will make its way to 2020 flagships like the Xiaomi Mi 10, OPPO Find X2, and many other high-end smartphones.

But just how much faster is it than the previous generations? We benchmarked Qualcomm’s Snapdragon 865 reference device at the event to find out. We pit the new SoC against the Snapdragon 855+, the Snapdragon 855, the Snapdragon 845, and the Kirin 990 from Huawei’s HiSilicon. We would have loved to test the Snapdragon 865 against the MediaTek Dimensity 1000 or Samsung Exynos 990, but sadly, there aren’t any devices with the new MediaTek and Samsung SoCs. Once we get our hands on real devices with the Snapdragon 865, we’ll be testing the real-world performance outside of benchmarks, too.


Qualcomm Snapdragon 865, Snapdragon 855, Snapdragon 845, and Kirin 990 Specifications

Qualcomm Snapdragon 865 Qualcomm Snapdragon 855+ Qualcomm Snapdragon 855 Qualcomm Snapdragon 845 HiSilicon Kirin 990 (4G)
CPU
  • 1 Kryo 585 ‘Prime’ (ARM Cortex-A77-based), up to 2.84GHz
  • 3 Kryo 585 ‘Performance’ (ARM Cortex-A77-based), up to 2.4GHz
  • 4 Kryo 385 ‘Efficiency’ (ARM Cortex-A55-based), up to 1.8GHz

25% Performance improvement over the previous generation

  • 1 Kryo 485 ‘Prime’ (ARM Cortex-A76-based), up to 2.96GHz
  • 3 Kryo 485 ‘Performance’ (ARM Cortex-A76-based), up to 2.42GHz
  • 4 Kryo 385 ‘Efficiency’ (ARM Cortex-A55-based), up to 1.8GHz
  • 1 Kryo 485 ‘Prime’ (ARM Cortex-A76-based), up to 2.84GHz
  • 3 Kryo 485 ‘Performance’ (ARM Cortex-A76-based), up to 2.42GHz
  • 4 Kryo 385 ‘Efficiency’ (ARM Cortex-A55-based), up to 1.8GHz

45% Performance improvement over the previous generation

  • 4 Kryo 385 ‘Performance’ (ARM Cortex-A75-based), up to 2.8GHz
  • 4 Kryo 385 ‘Efficiency’ (ARM Cortex-A55-based), up to 1.8GHz

25% Performance improvement over the previous generation

  • 2 ARM Cortex-A76, up to 2.86GHz
  • 2 ARM Cortex-A76, up to 2.09GHz
  • 4 ARM Cortex-A55, up to 1.86GHz
GPU Adreno 650

20% Performance improvement over the previous generation

Adreno 640 (15% overclocked) Adreno 640

20% Performance improvement over the previous generation

Adreno 630

25% Performance improvement over the previous generation

Mali-G76MP16
Memory 4x 16bit, 2133MHz LPDDR4X

4x 16bit, 2750MHz LPDDR5

4x 16bit, 2133MHz LPDDR4X 4x 16bit, 2133MHz LPDDR4X 4x 16-bit, 1866MHz LPDDR4X 4x 16-bit, LPDDR4X-4266
Manufacturing Process 7nm (TSMC N7P) 7nm (TSMC) 7nm (TSMC) 10nm LPP (Samsung) 7nm (TSMC)

Quick Overview of Each Benchmark

Benchmark explainer by Mario Serrafero

  • AnTuTu: This is a holistic benchmark. AnTuTu tests the CPU, GPU, and memory performance, while including both abstract tests and, as of late, relatable user experience simulations (for example, the subtest which involves scrolling through a ListView). The final score is weighted according to the designer’s considerations.
  • GeekBench: A CPU-centric test that uses several computational workloads including encryption, compression (text and images), rendering, physics simulations, computer vision, ray tracing, speech recognition, and convolutional neural network inference on images. The score breakdown gives specific metrics. The final score is weighted according to the designer’s considerations, placing a large emphasis on integer performance (65%), then float performance (30%) and finally crypto (5%).
  • GFXBench: Aims to simulate video game graphics rendering using the latest APIs. Lots of onscreen effects and high-quality textures. Newer tests use Vulkan while legacy tests use OpenGL ES 3.1. The outputs are frames during test and frames per second (the other number divided by the test length, essentially), instead of a weighted score.

    GFXBench Subscore Explanations. Click to expand.

    • Aztec Ruins: These tests are the most computationally heavy ones offered by GFXBench. Currently, top mobile chipsets cannot sustain 30 frames per second. Specifically, the test offers really high polygon count geometry, hardware tessellation, high-resolution textures, global illumination and plenty of shadow mapping, copious particle effects, as well as bloom and depth of field effects. Most of these techniques will stress the shader compute capabilities of the processor.
    • Manhattan ES 3.0/3.1: This test remains relevant given that modern games have already arrived at its proposed graphical fidelity and implement the same kinds of techniques. It features complex geometry employing multiple render targets, reflections (cubic maps), mesh rendering, many deferred lighting sources, as well as bloom and depth of field in a post-processing pass.

  • Speedometer, Jetstream: Javascript, core language features and performance on various operations; Javascript math, crypto, and search algorithm performance.
  • 3DMark (Sling Shot Extreme OpenGL ES 3.1/Vulkan): The test runs on a mobile-optimized rendering engine using OpenGL ES 3.1 and Vulkan (on Android) or Metal (on iOS). It comes with two subscores, each in turn featuring multiple subscores, all of which ultimately use frames per second as their metric across multiple testing scenarios. This benchmark will test the full range of API features, including transform feedback, multiple render targets and instanced rendering, uniform buffers, and features such as particle illumination, volumetric lighting, deferred lighting, depth of field and bloom in post-processing, all using compute shaders. Offscreen tests use a fixed time step between frames, and rule out any impact caused by vertical sync, display resolution scaling and related OS parameters. The final score is weighted according to the designer’s considerations.3DMark score weights
  • PCMark 2.0:  Tests the device as a complete unit. It simulates everyday use cases that can implement abstract algorithms and a lot of arithmetic; the difference is that these are dispatched within an application environment, with a particular practical purpose, and handled by API calls and Android libraries common to multiple applications. The test will output a variety of scores corresponding to the various subtests, which will be detailed below; the composite, Work 2.0 score is simply the geometric mean of all of these scores, meaning all tests are weighted equally.

    PCMark 2.0 Subscore Explanations. Click to expand.

    • Web browsing 2.0 simulates browsing social media: rendering the web page, searching for the content, re-rendering the page as new images are added, and so on. This subtest uses the native Android WebView to render (WebKit) and interact with the content, which is locally stored — this means you can run it offline, but it does not simulate web browsing fully as it rules out internet connection factors (latency, network speed). It is specifically tracking frame rates and completion time across seven tasks, with their score being a multiple of their geometric mean.
    • Video Editing simulates video editing performance: applying effects to a video using OpenGL ES 2.0 fragment shaders, decoding video frames (sent to an Android GLSurfaceView), and rendering/encoding the video in H.264/MPEG-4AVC at several frame rates and resolutions up to 4K. It is specifically tracking frame rates on the UI, except for a final test tracking the completion time of a video editing pipeline.
    • Writing simulates general document and text editing work: adding or editing texts and images within a document, copying and pasting text, and so on. It uses the native Android EditText view as well as PdfRenderer and PdfDocument APIs. It will open compressed documents, move text bodies, insert images in the document, then save them as a PDF, to then encrypt and decrypt them (AES). It specifically tracks task completion times for the processes of opening and saving files, adding images and moving text bodies, encrypt/decrypt the file, and render the PDF pages on ImageViews.
    • Photo Editing simulates photo-editing performance: opening images, applying different effects via filters (grains, blurs, embossing, sharpening and so on) and saving the image. It uses 4MP JPEG source images and manipulates them in bitmap format using the android.media.effect API, android.renderscript API’s RenderScript Intrinsics, android-jhlabs, and the native android.graphics API for drawing the process on the screen. This is an extremely comprehensive test in that it will be impacted by storage access, CPU performance, GPU performance, and it is dependent on many different Android APIs.  The test specifically measures memory and storage access times, encoding and decoding times, task completion times. The various filters and effects come from different APIs.
    • Data manipulation simulates database management operations: parsing and validating data from files, interacting with charts, and so on. It will open (date, value) tuples from CSV, XML, JSON files and then render animated charts with the MPAndroidChart library. It specifically tracks data parsing times as well as draws per second of each chart animation (similar to frame rate, but specific to the updating chart).

Source links for each benchmark can be found at the end of the article.


Test Devices

Qualcomm Snapdragon 865 Qualcomm Snapdragon 855+ Qualcomm Snapdragon 855 Qualcomm Snapdragon 845 HiSilicon Kirin 990
Device Name Qualcomm Reference Device (QRD) ASUS ROG Phone II Google Pixel 4 Google Pixel 3 XL Huawei Mate 30 Pro
Software Android 10 (Qualcomm customized AOSP software) Android 9 (ZenUI 6.0 OEM software with October 2019 security patch) Android 10 (Google Pixel OEM software with December 2019 security patch) Android 10 (Google Pixel OEM software with December 2019 security patch) Android 10 (EMUI 10.0 OEM software with October 2019 security patch)
Display 2880×1440 @ 60Hz 2340×1080 @ 60Hz 2280×1080 @ 60Hz 2960×1440 @ 60Hz 2400×1176 @ 60Hz
Memory 12GB LPDDR5 8GB LPDDR4X 6GB LPDDR4X 4GB LPDDR4X 8GB LPDDR4X
Storage 128GB UFS 3.0 128GB UFS 3.0 64GB UFS 2.1 64GB UFS 2.1 256GB UFS 3.0
Performance Mode Yes* No No No No

*Performance mode on the Snapdragon 865 QRD makes workloads appear 20% “heavier” to the scheduler. This means that a CPU that is loaded 80% will appear 100% loaded to the scheduler, ramping up clocks faster and migrating tasks from the little to the big cores faster. However, CPU clock speeds are NOT boosted.


Benchmark Results

Main Scores

Benchmark Version Qualcomm Snapdragon 865 Qualcomm Snapdragon 855+ Qualcomm Snapdragon 855 Qualcomm Snapdragon 845 HiSilicon Kirin 990
AnTuTu 8.0.4 565,384 425,963 386,499 278,647 389,505
Geekbench single-core 5.0.2 929 760 600 521 750
Geekbench multi-core 5.0.2 3,450 2,840 2,499 2,125 2,887
GFXBench ES 3.0 1080 Manhattan offscreen 5.00 126 110 92 82 104
GFXBench ES 3.1 1080 Carchase offscreen 5.00 50 48 40 35 38
GFXBench ES 3.1 1080 Manhattan offscreen 5.00 88 78 67 61 67
GFXBench ES 2.0 1080 T-Rex offscreen 5.00 205 185 164 152 105
GFXBench 1440p Aztec Ruins Vulkan (High Tier) Offscreen IFH 5.00 20 19 16 14 16
GFXBench 1440p Aztec Ruins OpenGL (High Tier) Offscreen IFH 5.00 20 18 16 14 18
Speedometer 2.00 80 36 53 49 65.4
JetStream – Geometric mean 1.10 123 116 98 85 95.8
PCMark – Work 2.0 2.0.3716 12,626 9,068 9,311 8,988 8,667
Androbench Sequential Read (MB/s) 5.0.1 1,459 1,398 873 659 1,451.09
Androbench Sequential Write (MB/s) 5.0.1 225 217 189 231 443.66
Androbench Random Read (IOPS) 5.0.1 50,378 41,315 37,600 32,376 53,114.78
Androbench Random Write (IOPS) 5.0.1 48,410 35,422 41,340 37,417 55,972.18
Androbench Random Read (MB/s) 5.0.1 195 161 147 126 207.47
Androbench Random Write (MB/s) 5.0.1 189 138 161 146 218.64
Androbench SQLite Insert 5.0.1 3,705 3,187 3,207 2,627 4,968.81
Androbench SQLite Update 5.0.1 4,014 3,931 3,996 3,333 6,090.65
Androbench SQLite Delete 5.0.1 5,037 4,964 4,558 4,081 7,664.88
3DMark Sling Shot Extreme Open GL ES 3.1 Overall Score 2.0.4646 7,008 6,201 5,174 3,431 5,677
3DMark Sling Shot Extreme Vulkan Overall Score 2.0.4646 6,449 5,339 4,339 3,273 4,303

Subscores

Benchmark Subscore Chart. Click to expand.

Benchmark Subscore Qualcomm Snapdragon 865 Qualcomm Snapdragon 855+ Qualcomm Snapdragon 855 Qualcomm Snapdragon 845
AnTuTu CPU 182,101 118,473 117,500 77,245
CPU Mathematical Operations 47,555 33,101 35,852 19,449
CPU Common Algorithms 40,260 23,468 20,400 13,203
CPU Multi-Core 94,286 61,904 61,248 44,593
GPU 218,496 193,905 160,291 117,022
GPU Terracotta – Vulkan 54,634 49,080 40,874 33,176
GPU Coastline – Vulkan 77,022 68,847 49,274 36,549
GPU Refinery – OpenGL ES3.1+AEP 86,840 75,978 70,143 58,356
MEM 81,392 65,011 56,889 46,041
MEM RAM Access 37,450 27,154 25,031 19,153
MEM ROM App IO 4,876 4,785 4,914 4,539
MEM ROM Sequential Read 22,039 20,046 13,240 9,499
MEM ROM Sequential Write 3,513 3,309 2,891 3,328
MEM ROM Random Access 13,514 9,718 10,813 9,523
UX 83,396 48,573 51,818 38,339
UX Data Security 13,788 8,835 9,384 6,041
UX Data Processing 28,615 9,852 9,088 5,959
UX Image Processing 14,473 9,799 12,741 10,192
UX User Experience 26,520 20,088 20,605 16,147
3DMark Sling Shot Extreme Open GL ES 3.1 Graphics Score 8,158 7,092 5,631 3,384
Sling Shot Extreme Open GL ES 3.1 Physics Score 4,693 4,308 4,401 3,623
Sling Shot Extreme Vulkan Graphics Score 8,224 6,557 4,845 3,425
Sling Shot Extreme Vulkan Physics Score 3,674 3,246 3,177 2,835
PCMark Web Browsing 2.0 score 11,680 6,427 6,985 7,806
Video Editing score 6,575 5,894 5,611 6,638
Writing 2.0 score 14,389 11,475 10,945 9,364
Photo Editing 2.0 score 36,868 18,247 22,159 17,516
Data Manipulation score 7,880 7,732 7,361 6,902
Geekbench Single-core Crypto Score 1,435 1,055 873 838
Single-core Integer Score 878 736 578 513
Single-core Floating Point Score 956 762 604 488
Multi-core Crypto Score 5,594 3,874 3,746 3,703
Multi-core Integer Score 3,304 2,764 2,410 2,093
Multi-core Floating Point Score 3,412 2,831 2,482 1,930

Main Scores Comparison

Subscore Versus Snapdragon 865 Versus Snapdragon 855+ Versus Snapdragon 855 Versus Snapdragon 845 Versus Kirin 990
AnTuTu 1x 1.33x 1.46x 2.03x 1.45x
Geekbench single-core 1x 1.22x 1.55x 1.78x 1.24x
Geekbench multi-core 1x 1.21x 1.38x 1.62x 1.2x
GFXBench ES 3.0 1080 Manhattan offscreen 1x 1.15x 1.37x 1.54x 1.21x
GFXBench ES 3.1 1080 Carchase offscreen 1x 1.04x 1.25x 1.43x 1.32x
GFXBench ES 3.1 1080 Manhattan offscreen 1x 1.13x 1.31x 1.44x 1.31x
GFXBench ES 2.0 1080 T-Rex offscreen 1x 1.11x 1.25x 1.35x 1.95x
GFXBench 1440p Aztec Ruins Vulkan (High Tier) Offscreen IFH 1x 1.05x 1.25x 1.43x 1.25x
GFXBench 1440p Aztec Ruins OpenGL (High Tier) Offscreen IFH 1x 1.11x 1.25x 1.43x 1.11x
Speedometer 1x 2.22x 1.51x 1.63x 1.22x
JetStream – Geometric mean 1x 1.06x 1.26x 1.45x 1.28x
PCMark – Work 2.0 1x 1.39x 1.36x 1.4x 1.46x
Androbench Sequential Read (MB/s) 1x 1.04x 1.67x 2.21x 1.01x
Androbench Sequential Write (MB/s) 1x 1.04x 1.19x 0.97x 0.51x
Androbench Random Read (IOPS) 1x 1.22x 1.34x 1.56x 0.95x
Androbench Random Write (IOPS) 1x 1.37x 1.17x 1.29x 0.86x
Androbench Random Read (MB/s) 1x 1.21x 1.33x 1.55x 0.94x
Androbench Random Write (MB/s) 1x 1.37x 1.17x 1.29x 0.86x
Androbench SQLite Insert 1x 1.16x 1.16x 1.41x 0.75x
Androbench SQLite Update 1x 1.02x 1x 1.2x 0.66x
Androbench SQLite Delete 1x 1.01x 1.11x 1.23x 0.66x
3DMark Sling Shot Extreme Open GL ES 3.1 Overall Score 1x 1.13x 1.35x 2.04x 1.23x
3DMark Sling Shot Extreme Vulkan Overall Score 1x 1.21x 1.49x 1.97x 1.50x

Subscores Comparison

Benchmark Subscores Comparison Chart. Click to expand.

Benchmark Subscore Versus Snapdragon 865 Versus Snapdragon 855+ Versus Snapdragon 855 Versus Snapdragon 845
AnTuTu CPU 1x 1.54x 1.55x 2.36x
CPU Mathematical Operations 1x 1.44x 1.33x 2.45x
CPU Common Algorithms 1x 1.72x 1.97x 3.05x
CPU Multi-Core 1x 1.52x 1.54x 2.11x
GPU 1x 1.13x 1.36x 1.87x
GPU Terracotta – Vulkan 1x 1.11x 1.34x 1.65x
GPU Coastline – Vulkan 1x 1.12x 1.56x 2.11x
GPU Refinery – OpenGL ES3.1+AEP 1x 1.14x 1.24x 1.49x
MEM 1x 1.25x 1.43x 1.77x
MEM RAM Access 1x 1.38x 1.5x 1.96x
MEM ROM App IO 1x 1.02x 0.99x 1.07x
MEM ROM Sequential Read 1x 1.1x 1.66x 2.32x
MEM ROM Sequential Write 1x 1.06x 1.22x 1.06x
MEM ROM Random Access 1x 1.39x 1.25x 1.42x
UX 1x 1.72x 1.61x 2.18x
UX Data Security 1x 1.56x 1.47x 2.28x
UX Data Processing 1x 2.9x 3.15x 4.8x
UX Image Processing 1x 1.48x 1.14x 1.42x
UX User Experience 1x 1.32x 1.29x 1.64x
3DMark Sling Shot Extreme Open GL ES 3.1 Graphics Score 1x 1.15x 1.45x 2.41x
Sling Shot Extreme Open GL ES 3.1 Physics Score 1x 1.09x 1.07x 1.3x
Sling Shot Extreme Vulkan Graphics Score 1x 1.25x 1.7x 2.4x
Sling Shot Extreme Vulkan Physics Score 1x 1.13x 1.16x 1.3x
PCMark Web Browsing 2.0 score 1x 1.82x 1.67x 1.5x
Video Editing score 1x 1.12x 1.17x 0.99x
Writing 2.0 score 1x 1.25x 1.31x 1.54x
Photo Editing 2.0 score 1x 2.02x 1.66x 2.1x
Data Manipulation score 1x 1.02x 1.07x 1.14x
Geekbench Single-core Crypto Score 1x 1.36x 1.64x 1.71x
Single-core Integer Score 1x 1.19x 1.52x 1.71x
Single-core Floating Point Score 1x 1.25x 1.58x 1.96x
Multi-core Crypto Score 1x 1.44x 1.49x 1.51x
Multi-core Integer Score 1x 1.2x 1.37x 1.58x
Multi-core Floating Point Score 1x 1.21x 1.37x 1.77x


Concluding Highlights

Analysis by Mario Serrafero:

  • For AnTuTu’s final score, we observe a large 33% bump over the 855+ and a massive improvement of around 45% over the 855. The CPU subtests showcase massive improvements, with uplifts in each subscore ranging from 15% to 97%. These results are surprising given that Qualcomm posted a respectable 25% CPU performance uplift over the Snapdragon 855, yet we see all CPU subscores go up by over 40%, and even 70%. The GPU side of the subscores, however, sees a much more restrained increase of around 13% on average, compared to the 855+, or 24% to 56% compared to our 855 scores from the Google Pixel 4.
  • The popular PCMark 2.0 saw a massive jump of almost 40% in its “Work 2.0” final score, compared to the 855+. Looking at the subscores, it seems that most of the improvement lies in the Photo Editing 2.0 subtest, which nearly doubles in score, followed by a Web Browsing score improvement of around 80%. The final score is simply the average between all subscores, so these massive bumps end up being balancing out the more conservative figures of the other subscores, which remain constant or rise by less than 25%.
  • Geekbench 5 subscores gave us a decent look into where the resulting ~20% increase in Single-core and Multi-core scores comes from. The crypto tests (which are weighted the least in calculating the final scores) had a performance increment of 36% and 44% (single and multi, respectively) compared to our 855+ results, whereas integer and floating-point performance only rose by about 19% to 25%, perfectly in-line with Qualcomm’s figures. The gap is much larger if we compare the 865 to our 855 results from the Pixel 4, as crypto goes up by 66% while integer and floating-point improvements sit over 50% for single-core tests and over 35% for multi-core tests. Given the 865 features the same clock speeds as the 855, we see a bump in integer and floating score performance per MHz.
  • 3DMark scores also fall more-or-less in line with the expected 20% faster graphics rendering that Qualcomm boasted at the Snapdragon tech summit. The graphics and physics scores saw an increase of 15% and 11% (respectively) over the 855+ for the OpenGL ES 3.1 test, and 25% and 22% for the Vulkan test. This suggests the 865 is a healthy upgrade for gamers.
  • GFXBench only saw a performance boost of 5% to 15% over the 855+, though when comparing it against the regular 855 those numbers jump above the 20% year-on-year increments posted by the company.

Recommended Reading


Benchmark Sources

CPU, GPU, and Memory

AnTuTu Benchmark (Free, Google Play) →

CPU and Memory

Geekbench 5 (Free, Google Play) →

System

PCMark for Android Benchmark (Free, Google Play) →

GPU

GFXBench Benchmark (Free, Google Play) →

3DMark - The Gamer's Benchmark (Free, Google Play) →

Storage

Androbench (Storage Benchmark) (Free, Google Play) →

Browser

Speedometer 2.0 ||| JetStream 1.1


Thanks to TK Bay for the featured image. Thanks to Max Weinbach for providing the Kirin 990 results from his Huawei Mate 30 Pro.

The post Qualcomm Snapdragon 865 Benchmarks: Comparing CPU and GPU Performance with the Kirin 990, Snapdragon 855, and Snapdragon 845 appeared first on xda-developers.

How Qualcomm Brought Tremendous Improvements in AI Performance to the Snapdragon 865

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It seems like we can’t go a day without seeing “artificial intelligence” in the news, and this past week was no exception in no small part thanks to the Snapdragon Tech Summit. Every year, Qualcomm unveils the plethora of improvements it brings to its Hexagon DSP and the Qualcomm AI Engine, a term they use for their entire heterogeneous compute platform – CPU, GPU, and DSP – when talking about AI workloads. A few years ago, Qualcomm’s insistence on moving the conversation away from traditional talking points, such as year-on-year CPU performance improvements, seemed a bit odd. Yet in 2019 and with the Snapdragon 865, we see that heterogeneous computing is indeed at the helm of their mobile computing push, as AI and hardware-accelerated workloads seem to sneak their way into a breadth of use cases and applications, from social media to everyday services.

The Snapdragon 865 is bringing Qualcomm’s 5th generation AI engine, and with it come juicy improvements in performance and power efficiency — but that’s to be expected. In a sea of specifications, performance figures, fancy engineering terms, and tiresome marketing buzzwords, it’s easy to lose sight of what these improvements actually mean. What do they describe? Why are these upgrades so meaningful to those implementing AI in their apps today, and perhaps more importantly, to those looking to do so in the future?

In this article, we’ll take an approachable yet thorough tour of the Qualcomm AI Engine combing through its history, its components and the Snapdragon 865’s upgrades, and most importantly, why or how each of these have contributed to today’s smartphone experience, from funny filters to digital assistants.

The Hexagon DSP and Qualcomm AI Engine: When branding makes a difference

While I wasn’t able to attend this week’s Snapdragon Tech Summit, I have nonetheless attended every other one since 2015. If you recall, that was the year of the hot mess that was the Snapdragon 810, and so journalists at that Chelsea loft in New York City were eager to find out how the Snapdragon 820 would redeem the company. And it was a great chipset, alright: It promised healthy performance improvements (with none of the throttling) by going back to the then-tried-and-true custom cores Qualcomm was known for. Yet I also remember a very subtle announcement that, in retrospect, ought to have received more attention: the second generation Hexagon 680 DSP and its single instruction, multiple data (SIMD) Hexagon Vector eXtensions, or HVX. Perhaps if engineers hadn’t named the feature, it would have received the attention it deserved.

This coprocessor allows the scalar DSP unit’s hardware threads to access HVX “contexts” (register files) for wide vector processing capabilities. It enabled the offloading of significant compute workloads from the power-hungry CPU or GPU to the power-efficient DSP so that imaging and computer vision tasks would run at substantially improved performance per milliwatt. They are perfect for applying identical operations on contiguous vector elements (originally just integers), making them a good fit for computer vision workloads. We’ve written an in-depth article on the DSP and HVX in the past, noting that the HVX architecture lends itself well to parallelization and, obviously, processing large input vectors. At the time, Qualcomm promoted both the DSP and HVX almost exclusively by describing the improvements they would bring to computer vision workloads such as the Harris corner detector and other sliding window methods.

It wasn’t until the advent of deep learning in consumer mobile applications that the DSP, its vector processing units (and now, a tensor accelerator) would get married to AI and neural networks, in particular. But looking back, it makes perfect sense: The digital signal processor (DSP) architecture, originally designed for handling digitized real-world or analog signal inputs, lends itself to many of the same workloads as many machine learning algorithms and neural networks. For example, DSPs are tailored for filter kernels, convolution and correlation operations, 8-bit calculations, a ton of linear algebra (vector and matrix products) and multiply-accumulate (MAC) operations, all most efficient when parallelized. A neural network’s runtime is also highly dependent on multiplying large vectors, matrices and/or tensors, so it’s only natural that the DSP’s performance advantages neatly translate to neural network architectures as well. We will revisit this topic in short!

In subsequent years, Qualcomm continued to emphasize that they offer not just chipsets, but mobile platforms, and that they focus not just on improving particular components, but delivering “heterogeneous” compute. In 2017, they released their Snapdragon Neural Processing Engine SDK (for runtime acceleration) on the Qualcomm Developer Network, and in early 2018 they announced the Qualcomm Artificial Intelligence Engine to consolidate their several AI-capable hardware (CPU, GPU, DSP) and software components under a single name. With this useful nomenclature, they were able to neatly advertise their AI performance improvements on both the Snapdragon 855 and Snapdragon 865, being able to comfortably spell out the number of trillions of operations per second (TOPS) and year-on-year percentage improvements. Harnessing the generational improvements in CPU, GPU, and DSP – all of which see their own AI-focused upgrades – the company is able to post impressive benchmarks against competitors, which we’ll go over shortly. With the company’s recent marketing efforts and unified, consistent messaging on heterogeneous computing, their AI branding is finally gaining traction among journalists and tech enthusiasts.

Demystifying Neural Networks: A mundane pile of linear algebra

To disentangle a lot of jargon we’ll come across later in the article, we need a short primer on what a neural network is and what you need to make it faster. I want to very briefly go over some of the mathematical underpinnings of neural networks, avoiding as much jargon and notation as possible. The purpose of this section is simply to identify what a neural network is doing, fundamentally: the arithmetic operations it executes, rather than the theoretical basis that justifies said operations (that is far more complicated!). Feel free to proceed to the next section if you want to jump straight to the Qualcomm AI Engine upgrades.

“Vector math is the foundation of deep learning.” – Travis Lanier, Senior Director of Product Management at Qualcomm at the 2017 Snapdragon Tech Summit

Below you will find a very typical feedforward fully-connected neural network diagram. In reality, the diagram makes the whole process look a bit more complicated than it is (at least, until you get used to it). We will compute a forward pass, which is ultimately what a network is doing whenever it produces an inference, a term we’ll encounter later in the article as well. At the moment, we will only concern ourselves with the machine and its parts, with brief explanations of each component.

A neural network consists of sequential layers, each comprised of several “neurons” (depicted as circles in the diagram) connected by weights (depicted as lines in the diagram). In general terms, there are three kinds of layers: the input layer, which takes the raw input; hidden layers, which compute mathematical operations from the previous layer, and the output layer, which provides the final predictions. In this case, we have only one hidden layer, with three hidden units. The input consists of a vector, array, or list of numbers of a particular dimension or length. In the example, we will have a two-dimensional input, let’s say [1.0, -1.0]. Here, the output of the network consists of a scalar or single number (not a list). Each hidden unit is associated with a set of weights and a bias term, shown alongside and below each node. To calculate the weighted sum output of a unit, each weight is multiplied with each corresponding input, and then the products are added together. Then, we will simply add the bias term to that sum of products, resulting in the output of the neuron. For example, with our input of [1.0,-1.0], the first hidden unit will have an output of 1.0*0.3 + (-1.0) * 0.2 + 1.0 = 1.1. Simple, right?

The next step in the diagram represents an activation function, and is what will allow us to produce the output vector of each hidden layer. In our case, we will be using the very popular and extremely simple rectified linear unit or ReLU, which will take an input number and output either (i) zero, if that number is negative or zero (ii) the input number itself, if the number is positive. For example, ReLU(-0.1) = 0, but ReLU(0.1) = 0.1. Following the example of our input as it propagates through that first hidden unit, the output of 1.1 that we computed would be passed into the activation function, yielding ReLU(1.1)=1.1. The output layer, in this example, will function just like a hidden unit: it will multiply the hidden units’ outputs against its weights, and then add its bias term of 0.2. The last activation function, the step function, will turn positive inputs into 1 and negative values into 0. Knowing how each of the operations in the network operates, we can write down the complete computation of our inference as follows:

That is all there is to our feedforward neural network computation. As you can see, the operations consist almost entirely of products and sums of numbers. Our activation function ReLU(x) can be implemented very easily as well, for example by simply calling max(x,0), such that it returns x whenever the input is greater than 0, but otherwise it returns 0. Note that step(x) can be computed similarly. Many more complicated activation functions exist, such as the sigmoidal function or the hyperbolic tangent, involving different internal computations and better-suited for different purposes. Another thing you can already begin noticing is that we also can run the three hidden units’ computations, and their ReLU applications, in parallel, as their values are not needed at the same time up until we calculate their weighted sum at the output node.

But we don’t have to stop there. Above, you can see the same computation, but this time represented with matrix and vector multiplication operations instead. To arrive at this representation, we “augment” our input vector by adding a 1.0 to it (lighter hue), such that when we put our weights and our bias (lighter hue) in the matrix as shown above, the resulting multiplication yields the same hidden unit outputs. Then, we can apply ReLU on the output vector, element-wise, and then “augment” the ReLU output to multiply it by the weights and bias of our output layer. This representation greatly simplifies notation, as the parameters (weights and biases) of an entire hidden layer can be tucked under a single variable. But most importantly for us, it makes it clear that the inner computations of the network are essentially matrix and vector multiplication or dot products. Given how the size of these vectors and matrices scale with the dimensionality of our inputs and the number of parameters in our network, most runtime will be spent doing these sorts of calculations. A bunch of linear algebra!

Our toy example is, of course, very limited in scope. In practice, modern deep learning models can have tens if not hundreds of hidden layers, and millions of associated parameters. Instead of our two-dimensional vector input example, they can take in vectors with thousands of entries, in a variety of shapes, such as matrices (like single-channel images) or tensors (three-channel RGB images). There is also nothing stopping our matrix representation from taking in multiple inputs vectors at once, by adding rows to our original input. Neural networks can also be “wired” differently than our feedforward neural network, or execute different activation functions. There is a vast zoo of network architectures and techniques, but in the end, they mostly break down to the same parallel arithmetic operations we find in our toy example, just at a much larger scale.

Visual example of convolution layers operating on a tensor. (Image credit: Towards Data Science)

For example, the popular convolutional neural networks (CNNs) that you likely have read about are not “fully-connected” like our mock network. The “weights” or parameters of its hidden convolutional layers can be thought of as a sort of filter, a sliding window applied sequentially to small patches of an input as shown above — this “convolution” is really just a sliding dot product! This procedure results in what’s often called a feature map. Pooling layers reduce the size of an input or a convolutional layer’s output, by computing the maximum or average value of small patches of the image. The rest of the network usually consists of fully-connected layers, like the ones in our example, and activation functions like ReLU. This is often used for feature extraction in images where early convolutional layers’ feature maps can “detect” patterns such as lines or edges, and later layers can detect more complicated features such as faces or complex shapes.

All of what’s been said is strictly limited to inference, or evaluating a neural network after its parameters have been found through training which is a much more complicated procedure. And again, we’ve excluded a lot of explanations. In reality, each of the network’s components is included for a purpose. For example, those of you who have studied linear algebra can readily observe that without the non-linear activation functions, our network simplifies to a linear model with very limited predictive capacity.

An Upgraded AI Engine on the Snapdragon 865 – A Summary of Improvements

With this handy understanding of the components of a neural network and their mathematical operations, we can begin to understand exactly why hardware acceleration is so important. In the last section, we can observe that parallelization is vital to speeding up the network given it allows us, for example, to compute several parallel dot-products corresponding to each neuron activation. Each of these dot-products is itself constituted of multiply-add operations on numbers, usually with 8-bit precision in the case of mobile applications, that must happen as quickly as possible. The AI Engine offers various components to offload these tasks depending on the performance and power efficiency considerations of the developer.

A diagram of a CNN for the popular MNIST dataset, shown on stage at this year’s Snapdragon Summit. The vector processing unit is a good fit for the fully-connected layers, like in our mock example. Meanwhile, the tensor processor handles the convolutional and pooling layers that process multiple sliding kernels in parallel, like in the diagram above, and each convolutional layer might output many separate feature maps.

First, let’s look at the GPU, which we usually speak about in the context of 3D games. The consumer market for video games has stimulated development in graphics processing hardware for decades, but why are GPUs so important for neural networks? For starters, they chew through massive lists of 3D coordinates of polygon vertices at once to keep track of an in-game world state. The GPU must also perform gigantic matrix multiplication operations to convert (or map) these 3D coordinates onto 2D planar, on-screen coordinates, and also handle the color information of pixels in parallel. To top it all off, they offer high memory bandwidth to handle the massive memory buffers for the texture bitmaps overlaid onto the in-game geometry. Its advantages in parallelization, memory bandwidth, and resulting linear algebra capabilities match the performance requirements of neural networks.

The Adreno GPU line thus has a big role to play in the Qualcomm AI Engine, and on stage, Qualcomm stated that this updated component in the Snapdragon 865 enables twice as much floating-point capabilities and twice the number of TOPS compared to the previous generation, which is surprising given that they only posted a 25% performance uplift for graphics rendering. Still, for this release, the company boasts a 50% increase in the number of arithmetic logic units (ALUs), though as per usual, they have not disclosed their GPU frequencies. Qualcomm also listed mixed-precision instructions, which is just what it sounds like: different numerical precision across operations in a single computational method.

Adreno 650 GPU in the Qualcomm Snapdragon 865

The Hexagon 698 DSP is where we see a huge chunk of the performance gains offered by the Snapdragon 865. This year, the company has not communicated improvements in their DSP’s vector eXtensions (whose performance quadrupled in last year’s 855), nor their scalar units. However, they do note that for this block’s Tensor Accelerator, they’ve achieved four times the TOPs compared to the version introduced last year in the Hexagon 695 DSP, while also being able to offer 35% better power efficiency. This is a big deal considering the prevalence of convolutional neural network architectures in modern AI use cases ranging from image object detection to automatic speech recognition. As explained above, the convolution operation in these networks produces a 2D array of matrix outputs for each filter, meaning that when stacked together, the output of a convolution layer is a 3D array or tensor.

Qualcomm also promoted their “new and unique” deep learning bandwidth compression technique, which can apparently compress data losslessly by around 50%, in turn moving half the data and freeing up bandwidth for other parts of the chipset. It should also save power by reducing that data throughput, though we weren’t given any figures and there ought to be a small power cost to compressing the data as well.

On the subject of bandwidth, the Snapdragon 865 supports LPDDR5 memory, which will also benefit AI performance as it will increase the speed at which resources and input data are transferred. Beyond hardware, Qualcomm’s new AI Model Efficiency Toolkit makes easy model compression and resulting power efficiency savings available to developers. Neural networks often have a large number of “redundant” parameters; for example, they may make hidden layers wider than they need to be. One of the AI Toolkit features discussed on stage is thus model compression, with two of the cited methods being spatial singular value decomposition (SVD) and bayesian compression, both of which effectively prune the neural network by getting rid of redundant nodes and adjusting the model structure as required. The other model compression technique presented on stage relates to quantization, and that involves changing the numerical precision of weight parameters and activation node computations.

The numerical precision of neural network weights refers to whether the numerical values used for computation are stored, transferred, and processed as 64, 32, 16 (half-precision) or 8-bit values. Using lower numerical precision (for example, INT8 versus FP32) reduces overall memory usage and data transfer speeds, allowing for higher bandwidth and faster inferences. A lot of today’s deep learning applications have switched to 8-bit precision models for inference, which might sound surprising: wouldn’t higher numerical accuracy enable more “accurate” predictions in classification or regression tasks? Not necessarily; higher numerical precision, particularly during inference, may be wasted as neural networks are trained to cope with noisy inputs or small disturbances throughout training anyway, and the error on the lower-bit representation of a given (FP) value is uniformly ‘random’ enough. In a sense, the low-precision of the computations is treated by the network as another source of noise, and the predictions remain usable. Heuristic explainers aside, it is likely you will accrue an accuracy penalty when lousily quantizing a model without taking into account some important considerations, which is why a lot of research goes into the subject

Back to the Qualcomm AI Toolkit: Through it they offer data-free quantization, allowing models to be quantized without data or parameter fine-tuning while still achieving near-original model performance on various tasks. Essentially, it adapts weight parameters for quantization and corrects for the bias error introduced when switching to lower precision weights. Given the benefits incurred by quantization, automating the procedure under an API call would simplify model production and deployment, and Qualcomm claims more than four times the performance per watt when running the quantized model.

But again, this isn’t shocking: quantizing models can offer tremendous bandwidth and storage benefits. Converting a model to INT8 not only nets you a 4x reduction in bandwidth, but also the benefit of faster integer computations (depending on the hardware). It is a no-brainer, then, that hardware-accelerated approaches to both the quantization and the numerical computation would yield massive performance gains. On his blog, for example, Google’s Pete Warden wrote that a collaboration between Qualcomm and Tensorflow teams enables 8-bit models to run up to seven times faster on the HVX DSP than on the CPU. It’s hard to overstate the potential of easy-to-use quantization, particularly given how Qualcomm has focused on INT8 performance.

The Snapdragon 865’s ARM-based Kryo CPU is still an important component of the AI engine. Even though the hardware acceleration discussed in the above paragraphs is preferable, sometimes we can’t avoid applications that do not properly take advantage of these blocks, resulting in CPU fallback. In the past, ARM had introduced specific instruction sets aimed at accelerating matrix- and vector-based calculations. In ARMv7 processors, we saw the introduction of ARM NEON, a SIMD architecture extension enabling DSP-like instructions. And with the ARMv8.4-A microarchitecture, we saw the introduction of an instruction specifically for dot-products.

All of these posted performance gains relate to many of the workloads we described in the previous section, but it’s also worth keeping in mind that these Snapdragon 865 upgrades are only the latest improvements in Qualcomm’s AI capabilities. In 2017, we documented their tripling of AI capabilities with the Hexagon 685 DSP and other chipset updates. Last year, they introduced their tensor accelerator, and integrated support for non-linearity functions (like the aforementioned ReLU!) at the hardware level. They also doubled the number of vector accelerators and improved the scalar processing unit’s performance by 20%. Pairing all of this with enhancements on the CPU side, like those faster dot-product operations courtesy of ARM, and the additional ALUs in the GPU, Qualcomm ultimately tripled raw AI capabilities as well.

Practical Gains and Expanded Use-Cases

All of these upgrades have lead to five times the AI capabilities on the Snapdragon 865 compared to just two years ago, but perhaps most importantly, the improvements also came with better performance per milliwatt, a critical metric for mobile devices. At the Snapdragon Summit 2019, Qualcomm gave us a few benchmarks comparing their AI Engine against two competitors on various classification networks. These figures look to be collected using AIMark, a cross-platform benchmarking application, which enables comparisons against Apple’s A-series and Huawei’s HiSilicon processors. Qualcomm claims that these results make use of the entire AI Engine, and we’ll have to wait until more thorough benchmarking to properly disentangle the effect of each component and determine how these tests were conducted. For example, do the results from company B indicate CPU fallback? As far as I’m aware, AIMark currently doesn’t advantage of the Kirin 990’s NPU on our Mate 30 Pro units, for example. But it does support the Snapdragon Neural Processing Engine, so it will certainly take advantage of the Qualcomm AI Engine; given it is internal testing, it’s not explicitly clear whether the benchmark is properly utilizing the right libraries or SDK for its competitors.

It must also be said that Qualcomm is effectively comparing the Snapdragon 865’s AI processing capabilities against previously-announced or released chipsets. It is very likely that its competitors will bring similarly-impactful performance improvements in the next cycle, and if that’s the case, then Qualcomm would only hold the crown for around half a year from the moment Snapdragon 865 devices hit the shelves. That said, these are still indicative of the kind of bumps we can expect from the Snapdragon 865. Qualcomm has generally been very accurate when communicating performance improvements and benchmark results of upcoming releases.

Qualcomm Snapdragon 865 AI performance versus competitors

All of the networks presented in these benchmarks are classifying images from databases like ImageNet, receiving them as inputs and outputting one out of hundreds of categories. Again, they rely on the same kinds of operations we described in the second section, though their architectures are a lot more complicated than these examples and they’ve been regarded as state of the art solutions at their time of publication. In the best of cases, their closest competitor provides less than half the number of inferences per second.

AI power consumption on the Qualcomm Snapdragon 865

In terms of power consumption, Qualcomm offered inferences per watt figures to showcase the amount of AI processing possible in a given amount of power. In the best of cases (MobileNet SSD), the Snapdragon AI Engine can offer double the number of inferences under the same power budget.

Power is particularly important for mobile devices. Think, for example, of a neural network-based Snapchat filter. Realistically, the computer vision pipeline extracting facial information and applying a mask or input transformation only needs to run at a rate of 30 or 60 completions per second to achieve a fluid experience. Increasing raw AI performance would enable you to take higher-resolution inputs and output better looking filters, but it might also simply be preferable to settle for HD resolution for quicker uploads and decrease power consumption and thermal throttling. In many applications, “faster” isn’t necessarily “better”, and one then gets to reap the benefits of improved power efficiency.

Snapdragon acceleration on the Qualcomm Snapdragon 865

During Day 2 of the Snapdragon Summit, Sr. Director of Engineering at Snapchat Yurii Monastyrshyn took the stage to show how their latest deep learning-based filters are greatly accelerated by Hexagon Direct NN using the Hexagon 695 DSP on the Snapdragon 865.

On top of that, as developers get access to easier neural network implementations and more applications begin employing AI techniques, concurrency use cases will take more of a spotlight as the smartphone will have to handle multiple parallel AI pipelines at once (either for a single application processing input signals from various sources or as many applications run separately on-device). While we see respectable power efficiency gains across the compute DSP, GPU, and CPU, the Qualcomm Sensing Hub handles always-on use cases to listen for trigger words at very low power consumption. It enables monitoring audio, video and sensor feeds at under 1mA of current, allowing the device to spot particular sound cues (like a baby crying), on top of the familiar digital assistant keywords. On that note, the Snapdragon 865 enables detecting not just the keyword but also who is speaking it, to identify an authorized user and act accordingly.

More AI on Edge Devices

These improvements can ultimately translate into tangible benefits for your user-experience. Services that involve translation, object recognition and labeling, usage predictions or item recommendations, natural language understanding, speech parsing and so on will gain the benefit of operating faster and consuming less power. Having a higher compute budget also enables the creation of new use cases and experiences, and moving processes that used to take place in the cloud onto your device. While AI as a term has been used in dubious, deceiving and even erroneous ways in the past (even by OEMs), many of your services you enjoy today ultimately rely on machine learning algorithms in some form or another.

But beyond Qualcomm, other chipset makers have been quickly iterating and improving on this front too. For example, the 990 5G brought a 2+1 NPU core design resulting in up to 2.5 times the performance of the Kirin 980, and twice that of the Apple A12. When the processor was announced, it was shown to offer up to twice the frames (inferences) per second of the Snapdragon 855 at INT8 MobileNet, which is hard to square with the results provided by Qualcomm. The Apple A13 Bionic, on the other hand, reportedly offered to six times faster matrix multiplication over its predecessor and improved its eight-core neural engine design. We will have to wait until we can properly test the Snapdragon 865 on commercial devices against its current and future competitors, but it’s clear that competition in this space never stays still as the three companies have been pouring a ton of resources into bettering their AI performance.

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Qualcomm announces the aptX Voice Bluetooth audio codec for improved voice call quality

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At CES‌ 2020, Qualcomm announced a new Bluetooth audio codec aimed at improving voice call quality. Aptly named aptX Voice, the new codec is part of the aptX Adaptive audio family. While mobile carriers have made great strides improving the voice call quality on their networks in recent years, users have not able to enjoy many of the improvements when they’re making calls over Bluetooth.

Qualcomm claims its new aptX Voice can fill this gap by offering the same HD‌ quality voice over Bluetooth that we enjoy on our smartphones.

aptX technology revolutionized the Bluetooth stereo listening experience by bringing unprecedented wireless audio quality, and aptX Voice is set to do the same for voice calls

James Chapman, VP and General Manager, Voice, Music and Wearables, Qualcomm Technologies International

Think of aptX Voice as aptX HD but for voice calls. The codec offers 32KHz sampled audio with a flat 16KHz frequency response which is significantly better than those offered by the narrowband Bluetooth codecs within the Bluetooth Handsfree Profile usually capped at a 8KHz sample rate. Qualcomm says the super-wideband support allows the codec to deliver superior voice clarity and speech intelligibility compared to the existing codecs. The codec will also reportedly make it easier to hear faint talkers, accented speakers, and double-talk, i.e. when both parties are speaking at the same time.

The aptX Voice will be offered as an optional codec in the aptX Adaptive suite. The codec is already supported on the Qualcomm Snapdragon 865 and Snapdragon 765 Mobile Platforms. It will be available for licensing to headphones and accessories makers as part of Qualcomm’s new range of Bluetooth Audio chips which the company plans to release later in 2020.


Source: Qualcomm

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Qualcomm announces the Snapdragon 720G, 662, and 460 SoCs with support for India’s NavIC

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In December 2019 at the Snapdragon Tech Summit in Hawaii, Qualcomm announced new mobile platforms – the Snapdragon 865 as well as the Snapdragon 765 and 765G – catering to the top and upper-mid tiers of the smartphones. Those chipsets were, respectively, upgrades to Qualcomm’s flagship SoCs – the Snapdragon 855/855 Plus – and the performance-oriented Snapdragon 730/730G. However, a bigger share of Qualcomm’s Snapdragon user base comes via the mid-range chipsets in the Snapdragon 600 series as well as the entry-level 400 series, especially in price-conscious markets like India, China, and other parts of Southeast Asia. Catering to these expectations, Qualcomm has just unveiled three new chipsets – the Snapdragon 720G, Snapdragon 662, and the Snapdragon 460 – at an event in New Delhi, India as upgrades to their existing lineup for the mid-tier and entry-level chipsets.

The key new features that these chipsets bring include Wi-Fi 6-readiness, Bluetooth 5.1, dual-frequency GNSS for accurate positioning, better power efficiency, and improved AI features. As Qualcomm believes the target group for these chips is far from adopting 5G anytime soon, these new chipsets instead bolster 4G connectivity by adding dual VoLTE support on the Snapdragon 720G, for instance.

Qualcomm Snapdragon 720G

Snapdragon 460 662 720G

Starting off with the chief chipset being announced today by Qualcomm, we have the Snapdragon 720G, which is evidently an upgrade to the Snapdragon 710/712 mobile platform. The suffix “G” adds the Snapdragon 720G chipset to Qualcomm’s lineup of gaming-focused chipsets with “Elite Gaming” features, which were announced last year along with the Snapdragon 855. The Snapdragon 720G will be manufactured on an 8nm process and uses newer Kryo 465 cores in Arm’s big.LITTLE configuration.

Besides the improvement in performance, the chipset gets a new AI engine that can be leveraged for more efficient gaming, photography, and performance while also improving the responsiveness of the virtual assistants. Meanwhile, the updated Spectra 360L ISP should expedite image processing. The Snapdragon 720G also gets support for up to 120Hz displays

Furthermore, the Snapdragon 720G brings improvements in connectivity by adding support for Wi-Fi 6. The new protocol allows the splitting of the data stream into sub-channels, allowing for more reliable connections. Of course, the feature only works if the router and device are Wi-Fi 6 certified but Qualcomm’s choice does future-proof the SoC. For more accurate positioning, the on-board GNSS chip will support connecting to dual frequencies. Additionally, the chip will be the first to support India’s newly announced satellite positioning system – NavIC.

Lastly, Bluetooth 5.1 and aptX Adaptive should bring high-quality low-latency wireless audio playback to mid-range devices with this chipset.

The table below compares the differences between the Snapdragon 712 and the newly announced 720G:

Qualcomm Snapdragon 712 Qualcomm Snapdragon 720G
CPU
  • 2 x Kryo 360 Performance cores (Based on Arm’s Cortex-A75) @ 2.3GHz
  • 6x Kryo 360 Efficiency cores (Based on Arm’s Cortex-A55)  @ 1.7GHz
  • 2 x Kryo 465 Performance cores (Based on Arm’s Cortex-A76) @ 2.3GHz
  • 6x Kryo 465 Efficiency cores (Based on Arm’s Cortex-A55)  @ 1.8GHz
GPU Adreno 616 Adreno 618
15% better performance and efficiency
AI Hexagon 685 Hexagon 692
5th generation AI Engine
Qualcomm Hexagon Tensor AcceleratorQualcomm Sensing Hub
ISP
  • Spectra 250 ISP
  • Single camera: Up to 192MP
  • Double camera (MFNR, ZSL, 30fps): Up to 16MP
  • Video capture: 4K
  • Spectra 350L ISP
  • Single camera: Up to 192MP
  • Video capture: 4K
Modem
  • Snapdragon X15 LTE modem
  • 4×4 MIMO
  • Downlink: 800Mbps (4G LTE)
  • Uplink: 150Mbps (4G LTE)
  • Carrier Aggregation: 3 x 20MHz (down); 2 x 20MHz (up)
  • Snapdragon X15 LTE modem
  • 4×4 MIMO, 3CA, 256-QAM
  • Downlink: 800Mbps (4G LTE)
  • Uplink: 150Mbps (4G LTE)
  • Carrier Aggregation: 3 x 20MHz (down); 2 x 20MHz (up)
Charging Qualcomm Quick Charge 4+ Qualcomm Quick Charge 4+
Connectivity
  • Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS
  • Wi-Fi: 2.4/5GHz Bands; 20/40/80 MHz Channel; DBS, TWT, WPA3, 2×2 MU-MIMO
  • Bluetooth: Version 5.0, aptX
  • Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS, NavIC Dual Frequency support
  • Wi-Fi: Qualcomm FastConnect 6200; Wi-Fi 6 ready; 2.4/5GHz Bands; WPA3, 8×8 MU-MIMO
  • Bluetooth: Version 5.1, aptX Adaptive
Manufacturing Process 10nm LPP FinFET 8nm

Qualcomm Snapdragon 662

Snapdragon 460 662 720G

Last year, Qualcomm announced the Snapdragon 665 mobile platform as a more power-efficient option between the Snapdragon 660 and the Snapdragon 670. Now, alongside the Snapdragon 720G, we’re seeing another chipset filling the space between the Snapdragon 660 and the 665 and it has been named the Snapdragon 662.

The Snapdragon 662 features a new Spectra 340T ISP which improves imaging in low light scenarios and can add support for augmented reality features via the camera. The chipset gets Wi-Fi 6 support via Qualcomm’s FastConnect 6100 but the LTE modem has been downgraded. Besides Wi-Fi 6, the chipset also gets support for NavIC. Furthermore, there’s Bluetooth 5.1 along with aptX TrueWireless Surround codec support.

The table below compares the Snapdragon 662 with the Snapdragon 660 and the 665:

Qualcomm Snapdragon 660 (sdm660) Qualcomm Snapdragon 662 Qualcomm Snapdragon 665 (sm6125)
CPU 4 x performance and 4 x efficiency Kryo 260 CPU cores (Up to 2.2GHz) 4 x performance and 4 x efficiency Kryo 260 CPU cores (Up to 2.0GHz) 4 x performance and 4 x efficiency Kryo 260 CPU cores (Up to 2.0GHz)
GPU
  • Adreno 512
  • Vulkan 1.0 support
  • Adreno 610
  • Vulkan 1.1 support
  • Adreno 610
  • Vulkan 1.1 support
AI Hexagon 680 Hexagon 683
Qualcomm Sensing Hub
Hexagon 686
Memory
  • Type: LPDDR4/4X
  • Speed: Up to 1866MHz, 8GB RAM
  • Type: LPDDR4/4X
  • Speed: Up to 1866MHz, 8GB RAM
  • Type: LPDDR4/LPDDR4x
  • Speed: Up to 1866MHz, 8GB RAM
ISP
  • Dual 14-bit Spectra 160 ISP
  • Single camera: Up to 25 MP, MFNR, ZSL, 30fps; Up to 48MP
  • Dual camera: Up to 16 MP, MFNR, ZSL, 30fps
  • 4k @ 30fps video
  • Spectra 340T ISP
  • Single camera: Up to 48 MP, HEIF support
  • Triple camera support
  • Dual 14-bit Spectra 165 ISP
  • Single camera: Up to 25 MP, MFNR, ZSL, 30fps; Up to 48MP
  • Dual camera: Up to 16 MP, MFNR, ZSL, 30fps
  • 4K @ 30fps video
Modem
  • Snapdragon X12
  • 600Mbps DL (Cat. 12),
  • 150Mbps UL (Cat. 13)
  • Snapdragon X11
  • 2CA, 2×2 MIMO, 256-QAM
  • 390Mbps DL (Cat. 12),
  • 150Mbps UL (Cat. 13)
  • Snapdragon X12
  • 600Mbps DL (Cat. 12)
  • 150Mbps UL (Cat. 13)
Charging Qualcomm Quick Charge 3.0 Qualcomm Quick Charge 3.0 Qualcomm Quick Charge 3.0
Connectivity
  • Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS
  • Wi-Fi: 2.4/5GHz Bands; 2 x 2 MIMO
  • Bluetooth: Version 5.0, aptX
  • Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS, NavIC
  • Wi-Fi: Qualcomm FastConnect 6100; Wi-Fi 6 ready; 2.4/5GHz Bands;
  • Bluetooth: Version 5.1, aptX TWS
  • Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS
  • Wi-Fi: 2.4/5GHz Bands; 2×2 MIMO
  • Bluetooth: Version 5.0, aptX
Manufacturing Process 14nm FinFET 11nm 11nm FinFET

Qualcomm Snapdragon 460

Snapdragon 460 662 720G

Besides the two mid-range chipsets, Qualcomm has also announced the new Snapdragon 460 SoC for entry-level devices and it looks like a successor to the Snapdragon 450. For the first time, Qualcomm has introduced the Kryo branding for the CPUs in the Snapdragon 400 series with new Kryo 240 clusters. Compared to the Snapdragon 450, Qualcomm claims that with the new performance cores in the Snapdragon 460, the CPU gets a massive 70% boost in performance. Further, the chipset has been upgraded with the Adreno 610 GPU – which traditionally belongs to the 600 series – and this brings up to a 60% boost in GPU performance compared to the 450. Overall, Qualcomm says the Snapdragon 460 delivers 2x system performance compared to the Snapdragon 450. It is safe to assume that Qualcomm is gearing users up in the entry-level segment for graphics-heavy or AR-based entertainment and mobile gaming use cases. The new GPU also brings support for the Vulkan graphics API, which is now being adopted by many game developers.

Additionally, the Snapdragon 460 mobile platform brings a new DSP for improvements in AI-related applications, especially associated with voice operations. An improved ISP for smoother and faster image processing also adds support for triple cameras. Further, the new Snapdragon X11 modem increases 4G peak speeds while the chipset also gets support for Wi-Fi 6 and NavIC positioning technology.

The table below compares the features of the Snapdragon 450 and the 460:

Qualcomm Snapdragon 450 (sdm450) Qualcomm Snapdragon 460 (SM4250-AA)
CPU 8 x Arm Cortex-A53 (up to 2.2GHz) 8 x Kryo 240 cores (up to 2.3GHz)
GPU
  • Adreno 506
  • OpenGL ES 3.1+ support
  • Adreno 610
  • Vulkan 1.1 support
AI Hexagon 546 Hexagon 683
Hexagon Vector eXtensions (HVX)
3rd generation AI Engine
Qualcomm Sensing Hub
Memory
  • Type: LPDDR3
  • Speed: Up to 933MHz
  • Type: LPDDR4/4X
  • Speed: Up to 1866MHz, 8GB RAM
  • 2x Image Signal Processor (ISP) unspecified
  • Single camera: Up to 24 MP (24fps), 21MP
  • Dual camera: Up to 13 MP
  • Spectra 340 ISP
  • Single camera: Up to 25 MP
  • Dual camera: Up to 16 MP
  • Triple camera support
Modem
  • Snapdragon X9
  • 300Mbps DL (Cat. 7)
  • 150Mbps UL (Cat. 13)
  • Snapdragon X11
  • 390Mbps DL (Cat. 12)
  • 150Mbps UL (Cat. 13)
Charging Qualcomm Quick Charge 3.0 Qualcomm Quick Charge 3.0
Connectivity
  • Location: Beidou, Galileo, GLONASS, GPS
  • Wi-Fi: 2.4/5GHz Bands; 20/40/80 MHz Channel; DBS, TWT, WPA3, 1 x 1 MIMO
  • Bluetooth: Version 4.1
  • Location: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS, NavIC, Dual-frequency (L1+L5)
  • Wi-Fi: Qualcomm FastConnect 6100; Wi-Fi 6 ready; 2.4/5GHz Bands
  • Bluetooth: Bluetooth 5.1, aptX Adaptive and aptX TWS
  • NFC support
Manufacturing Process 14nm LPP 11nm

Availability

The first set of devices with the Snapdragon 720G will be available in the market really soon. Qualcomm announced that devices featuring the Snapdragon 720G will be available within the first quarter of 2020 itself. Officials from the Indian Space Research Organisation (ISRO) recently said that some of the phones to come with NavIC support will be made by Xiaomi in India.

Realme CEO just tweeted out saying they will soon be launching one of the first Snapdragon 720G devices in India soon.

Meanwhile, Xiaomi India’s MD Manu Kumar Jain also announced that they will be bringing new devices with all three of the new chipsets.

For devices based on Snapdragon 662 and Snapdragon 460, there’s a long waiting period and the first batch of devices will not be available until late 2020.

The post Qualcomm announces the Snapdragon 720G, 662, and 460 SoCs with support for India’s NavIC appeared first on xda-developers.

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